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Devices using silicone pressure sensitive adhesives containing organic wax

a technology of silicone and organic wax, which is applied in the direction of pharmaceutical delivery mechanisms, dressings, bands, etc., can solve the problems of increasing profits and cost savings, and achieve the effects of reducing the dynamic viscosity of adhesives, less viscosity, and improving adhesive coatability

Inactive Publication Date: 2000-06-27
DOW CORNING CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This invention provides a hot-melt pressure sensitive adhesive composition which is formed of materials which are highly acceptable in topical applications. The hot-melt silicone pressure sensitive adhesive compositions of this invention contain an organic wax which renders the adhesive less viscous at temperatures up to about 200.degree. C. and therefore improves adhesive coatability over the prior art silicone PSA's and the hot-melt PSA of U.S. Pat. No. 4,865,920. The invention also provides a means of controlling the pressure sensitive adhesive properties of tack, adhesion, and release of the composition.
The hot-melt silicone pressure sensitive adhesive composition comprises a mixture of (i) a silicate resin and (ii) a silicone fluid, the mixture exhibiting tackiness and adhesiveness, the mixture being blended with (iii) an organic wax having a melting point between about 30.degree. C. and 150.degree. C., and which decreases the dynamic viscosity of the adhesive at temperatures equal to or below 200.degree. C. Improved adhesive coatability, minimizes waste of materials during manufacture and expedites production. This results in cost savings and increases profits. The invention also encompasses methods of using the composition, and devices made using the compositions.

Problems solved by technology

This results in cost savings and increases profits.

Method used

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  • Devices using silicone pressure sensitive adhesives containing organic wax
  • Devices using silicone pressure sensitive adhesives containing organic wax
  • Devices using silicone pressure sensitive adhesives containing organic wax

Examples

Experimental program
Comparison scheme
Effect test

example 1

Adhesive formulations combining PSA I and amounts of organic waxes were prepared as set forth in Tables 1A and 1B. As shown in Table 1A, these adhesive preparations were evaluated for physical properties of tack, release, adhesion and shear. Tack values ranged between 86 and 341 gm / cm.sup.2, and all were well within the acceptable range of 50 to 800 gm / cm.sup.2. Release values ranged between 1.6 and 9.3 gm / cm. All samples were within the acceptable range of less than or equal to 50 gm / cm. Adhesion values for our samples ranged between 228 and 729 gm / cm. These values were all within the acceptable range of 100-2000 gm / cm. Shear values ranged from 12.06 to 16.06 Kg / 6.25 cm.sup.2 and were within the acceptable range of 4 to 20 kg / 6.25 cm.sup.2.

As shown in Table 1B, the Rheological properties of Elastic Modulus (G') and Dynamic Viscosity (n*) were evaluated for formulations of PSA I containing various organic waxes. Particularly relevant are the values measured at temperatures utilized ...

example 2

Adhesive formulations combining Control PSA II with varying amounts of organic waxes were prepared as set forth in Tables 2A and 2B. As shown in Table 2A, these adhesive preparations were evaluated for physical properties of tack, release, adhesion and shear. Tack values for all samples were outside the acceptable range of 50 to 2000 gm / cm.sup.2. Release values ranged between 0 and 0.8 gm / cm. All samples were within the acceptable release value range of less than or equal to 50 gm / cm. All samples were within the acceptable range for adhesion values of 100-2000 gm / cm.sup.2. All samples had shear values within the acceptable range of 4 to 20 kg / 6.25 cm.sup.2.

As shown in Table 2B, the Rheological properties of Elastic Modulus (G') and Dynamic Viscosity (n*) were evaluated for the various adhesive formulations. Particularly relevant are the values measured at temperatures equal to or below 200.degree. C. Elastic Modulus Values (G') equal to or less than 45,000 dynes / cm.sup.2 at 200.degr...

example 3

Now we look at adhesive formulations combining Control PSA III with varying amounts of organic waxes which were prepared as set forth in Tables 3A and 3B. As shown in Table 3A, these adhesive preparations were evaluated for physical properties of tack, release, adhesion and shear. Tack values ranged between 97 and 371 gm / cm.sup.2 were well within the acceptable range of 50 to 800 gm / cm.sup.2. Release values ranged between 1.2 and 16.1 gm / cm. All samples were within the acceptable range of less than or equal to 50 gm / cm. Adhesion values ranged between 134 and 683 gm / cm. All samples were within the acceptable adhesion range of 100-2000 gm / cm. Shear values ranged from 12.81 to 15.91 kg / 6.25 cm.sup.2 and were within the acceptable range of 4 to 20 kg / 6.25 cm.sup.2.

As shown in Table 3B, the Rheological properties of Elastic Modulus (G') and Dynamic Viscosity (n*) were evaluated for the various adhesive formulations. Particularly relevant are the values measured at temperatures equal to o...

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Abstract

Hot-melt silicone pressure sensitive adhesive compositions containing organic waxes, methods of using the compositions and devices made using the compositions are disclosed. The hot-melt silicone pressure sensitive adhesive compositions include a mixture of (i) a silicate resin, (ii) a silicone fluid, and (iii) an organic wax having a melting point of between 30 DEG C. and 150 DEG C. The organic wax decreases dynamic viscosity of the adhesive at temperatures equal to or below about 200 DEG C.

Description

This application is a Reissue of Ser. No. 07 / 733,567, filed Jul. 22, 1991, now U.S. Pat. No. 5,328,696. .Iaddend.TECHNICAL FIELDThe present invention relates to hot-melt silicone pressure sensitive adhesive compositions containing organic wax, methods of using the composition, and devices made using the composition.BACKGROUND OF THE INVENTIONA pressure sensitive adhesive, generally, is a material which adheres to a surface with slight pressure and releases from the surface with negligible transfer of the material to the surface. Silicone pressure sensitive adhesives that are known in the art are typically solvent-based adhesives. The solvents are employed primarily to reduce the viscosity of the silicone pressure sensitive adhesive to a viscosity which is easily coated onto the substrate of choice, and the solvents are removed after coating. As with any solvent-based pressure sensitive adhesive (PSA), special precautions must be taken to contain and avoid environmental exposure of t...

Claims

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Application Information

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IPC IPC(8): A61K9/70C09J183/00C09J183/02C09J183/04A61L15/34A61L15/58
CPCA61K9/7069A61K9/7084A61L15/34A61L15/58C09J183/02C09J183/04C08L83/04C08L91/06
Inventor NOEL, ROSS ALAN
Owner DOW CORNING CORP
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