Magnetic Memory Devices

Abstract

A STT-MRAM comprises apparatus and a method of manufacturing a plurality of magnetoresistive memory element having a dielectric thermal buffer layer between a thin top electrode of the MTJ element and a bit line, and a bit-line VIA electrically connecting the top electrode and the bit line having a vertical distance away from the location of the MTJ stack. In a laser thermal annealing, a short wavelength of a laser has a shallow thermal penetration depth and a high thermal resistance from the bit line to the MTJ stack only causes a temperature rise of the MTJ stack being much smaller than that of the bit line. As the temperature of the MTJ element during the laser thermal annealing of bit line copper layer is controlled under 300-degree C., possible damages on MTJ and magnetic property can be avoided.

Description

RELATED APPLICATIONS[0001]This application claims the priority benefit of U.S. Provisional Application No. 61,820,101 filed on May 6, 2013, which is incorporated herein by reference. This application is a divisional divisional application due to a restriction requirement on application Ser. No. 14 / 269,066.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]This invention relates generally to a spin-transfer-torque magnetic-random-access memory (MRAM) cell having a heat buffer (barrier) layer for reducing undesirable heating of the magnetic tunneling junction during pulsed laser heating annealing of upper copper bit lines.[0004]2. Description of the Related Art[0005]In recent years, magnetic random access memories (hereinafter referred to as MRAMs) using the magnetoresistive effect of ferromagnetic tunnel junctions (also called MTJs) have been drawing increasing attention as the next-generation solid-state nonvolatile memories that can also cope with high-speed reading an...

AI Technical Summary

Benefits of technology

[0013]The present invention comprises a magnetoresistive memory cell having a heat barrier for reducing undesirable heating of the magnetic tunneling junction during pulsed laser heating annealing of upper copper bit lines.

[0016]In a laser thermal annealing, a short wavelength of a laser has a shallow thermal penetration depth which reduces direct heating to the lower magnetic materials. In this invention, a dielectric thermal buffer or barrier layer having a low thermal conductivity is deposited between a thin top electrode of the MTJ element and a bit line, while the VIA electrically connecting the top electrode and the bit line has a vertical distance away from the location of the MTJ element. Thus, a high thermal resistance from the bit line to the MTJ element is achieved, and the temperature rise of the MTJ element is much smaller than that of the bit line during a pulsed laser thermal annealing. As the temperature of the MTJ element during the laser thermal annealing of bit line copper layer is controlled under 300-degree C., there is no damage on MTJ and magnetic property.

Problems solved by technology

However re-crystallization is not under control and not uniform in this case and depends also on the width of the Cu lines.

Microstructural, mechanical and contamination results show that rapid thermal anneals at 400° C. offer performances that are similar to longer furnace anneals at the same temperature, whereas 250° C. anneals are insufficient and 300° C. anneals are marginal.

A typical MTJ would be damaged or partially damaged by a conventional uniform high temperature annealing of copper lines by long batch furnace thermal treatments.

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