Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Memory device and method of operation of such a memory device

a memory device and memory technology, applied in the field of memory devices, can solve the problems of insufficient write margin, significant power consumption, short circuit current path, etc., and achieve the effect of reducing power consumption in those components

Active Publication Date: 2015-03-26
ARM LTD
View PDF1 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes a memory device that uses a dedicated level shifting circuit to level shift signals between different voltage domains. This circuit helps to ensure correct writing of data, even when there is a large difference in voltage between the different domains. However, this circuit comes with the drawback of increased power consumption and area usage. To address this, the patent suggests using a P / N skew to shift the drive strength of transistors in the circuit, which allows the circuit to level shift signals within a certain range. This reduces power consumption and the need for separate level shifting circuits. Additionally, the patent proposes controlling the precharge circuit and the write driver circuit using control signals that switch between a ground voltage level and the peripheral voltage level, which further reduces power consumption. The patent also mentions using a NAND circuit component with the P / N skew to increase the drive strength of NMOS transistors relative to PMOS transistors. Overall, the patent proposes various methods to reduce power consumption and improve the performance of memory devices.

Problems solved by technology

The level up shifting mechanism 40 is generally more problematic to implement than the level down shifting mechanism 50 (in fact in many instances no specific level down shifting circuitry may be required), since when performing level up shifting there is the potential for establishing various DC paths that can result in significant power consumption, and which may potentially create short circuit current paths.
In particular, it has been found that the write margin can be insufficient unless such level shifting has been performed.
Whilst this ensures correct operation, it has a significant impact on the overall power consumption of the memory device.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Memory device and method of operation of such a memory device
  • Memory device and method of operation of such a memory device
  • Memory device and method of operation of such a memory device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041]FIG. 2 is a diagram schematically illustrating a logical arrangement of a memory device in accordance with one embodiment. In particular, the memory device 100 includes a memory array 105 comprising an array of memory cells arranged in a plurality of rows and columns. A plurality of word lines 145 are provided through the array in order to allow individual rows of memory cells to be addressed by the word line driver circuitry 140 during write and read operations. In addition, a plurality of bit lines are provided in association with the columns of memory cells, in this embodiment each column having an associated pair of bit lines, to enable data to be written into an addressed memory cell of that column during a write operation, and for data to be read from an addressed memory cell of that column during a read operation.

[0042]Precharge circuitry 115 is used to precharge the voltage level on the bit lines under the control of control circuitry 110. Following the precharge opera...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A memory device having an array of memory cells connected to a core voltage level, and access circuitry used to perform a write operation in order to write data into a plurality of addressed memory cells. At least one bit line associated with at least each column in the array containing an addressed memory cell is precharged to the peripheral voltage level prior to the write operation being performed. Word line driver circuitry is then configured to assert a word line signal at the core voltage level on the word line associated with the row of the array containing the addressed memory cells. Write multiplexing driver circuitry asserts a mux control signal to write multiplexing circuitry which then couples the bit line of each addressed memory cell to the write driver circuitry in dependence on the mux control signal identifying which column contains the addressed memory cells.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a memory device and to a method of operation of such a memory device, and in particular to a mechanism for operating such a memory device when the access circuitry used to access the array of memory cells is operated from a peripheral voltage domain with a supply voltage less than the supply voltage in a core voltage domain used by the array of memory cells.[0003]2. Description of the Prior Art[0004]In modern data processing systems, it is becoming more and more common for certain parts of the data processing system to operate in a different voltage domain to one or more other parts. For example, a trend within integrated circuits is the increasingly common use of embedded memory, such as SRAM memory. With the reduction in size of process geometries, the individual memory cells within the memory are becoming less stable. To reduce the power consumption of the integrated circuit, it is de...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): G11C7/12G06F17/50
CPCG11C7/12G06F2217/78G06F17/505G11C7/1096G11C8/10G11C11/413G11C11/418G11C11/419G11C16/08H03K17/005
Inventor ZHENG, BOKWON, JUNGTAEYEUNG, GUSCHONG, YEW KEONG
Owner ARM LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products