Heat dissipating structure and method of manufacturing same

Abstract

A heat dissipating structure and a method of manufacturing same is disclosed. The heat dissipating structure includes a base being formed on one face with lower pipe-receiving grooves, a cover being formed on one face facing to the base with upper pipe-receiving grooves, and heat pipes disposed between the base and the cover. A heat-conducting substance is applied in the lower and upper pipe-receiving grooves, whereby when the cover is tightly pushed against the base, the heat pipes are tightly fitted in and between the lower and the upper pipe-receiving grooves. Radiating fins can be provided on the cover. When the base is attached at another face to an electronic device, heat produced by the electronic device can be effectively transferred to and dissipated from the heat dissipating structure, which has tightly connected base, heat pipes, and cover to ensure high heat dissipating effect without the need of tin soldering.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a heat dissipating structure and a method of manufacturing same; and more particularly to a heat dissipating structure and a method of manufacturing same that avoids environmental pollution and hazards to human body caused by tin soldering.BACKGROUND OF THE INVENTION[0002]According to currently available techniques, when using a heat pipe, the heat pipe has one end being located at a high-temperature interface and another end at a low-temperature interface, so that heat transfer in the heat pipe occurs. That is, at the high-temperature interface, heat passes through a metal wall of the heat pipe into a wick structure provided inside the heat pipe. A working fluid in the wick structure is heated and evaporates. The end of the heat pipe at the high-temperature interface is referred to as an evaporating section. The vapor of the evaporated working fluid gathers in a hollow pipe at the evaporation section and flows to the othe...

AI Technical Summary

Benefits of technology

[0009]A primary object of the present invention is to provide a heat dissipating structure that has a plurality of heat pipes tightly fitted between a base and a cover, and a heat-conducting substance being applied between the heat pipes and the base and the cover to ensure good heat conducting and dissipating effects.

[0010]Another object of the present invention is to provide a method of manufacturing a heat dissipating structure without the need of tin soldering to thereby effectively avoid environmental pollution and hazards to human body caused by tin soldering as found in conventional method of manufacturing the heat dissipating structure.

[0011]To achieve the above and other objects, the heat dissipating structure according to the present invention includes a base being formed on one face with lower pipe-receiving grooves; a plurality of heat pipes being disposed in the lower pipe-receiving grooves with a heat-conducting substance, such as a heat-conducting paste, a heat-conducting gel, or other types of thermal paste, being applied between the lower pipe-receiving grooves and the heat pipes; and a cover being closed on the heat pipes and formed on one face with upper pipe-receiving grooves for engaging with the heat pipes, and a heat-conducting substance, such as a heat-conducting paste, a heat-conducting gel, or other types of thermal paste, being applied between the upper pipe-receiving grooves and the heat pipes; whereby the cover can be tightly closed and connected to the base.

Problems solved by technology

The above-described conventional heat dissipating structure 1 has a main problem in implementation thereof.

By doing this, it tends to cause environmental pollution and hazards to human body.

In brief, the conventional heat dissipating structure 1 has the following disadvantages: (1) causing environmental pollution; (2) bringing hazards to human body; and (3) requiring high manufacturing cost.

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