Vapor chamber and supporting structure thereof

Abstract

In a vapor chamber and a supporting structure thereof, the vapor chamber includes a casing, in which a capillary wick and a supporting structure are accommodated. The supporting structure includes a plate, on which a plurality of channels are disposed at equal intervals and arranged by corresponding to each other. A corrugated piece is formed in each channel and upper and lower sides of the corrugated piece are respectively abutted against the capillary wick, making the capillary wick and inner wall faces of the casing tightly contacted to each other. In addition, a vapor chamber having this kind of supporting structure is provided. Thereby, it is possible to increase the phase-changing amount of the vapor chamber, accelerate the heat-transferring speed, and enhance the heat-conducting performance further.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention generally relates to a supporting structure, in particular, to a supporting structure for vapor chamber and a vapor chamber.[0003]2. Description of Prior Art[0004]Following continuous promotion in computing speed, more and more heat is generated in a computer's CPU. Thus, a cooling device comprised of aluminum-extruding cooler and fan has already been unable to satisfy the using requirement of current CPU. So, some relative industries subsequently develop heat pipe and vapor chamber, both of which have a higher heat-transferring performance. A cooler integrated with heat pipe or vapor chamber can effectively solve the cooling problem currently existed. Besides, since a vapor chamber is directly attached to heating electronic element with large contacting area, it attracts many relative industries to devote more efforts into the R&D work of this kind of vapor chamber.[0005]As shown in FIG. 1, accord...

AI Technical Summary

Benefits of technology

[0008]The invention is mainly to provide a vapor chamber and a supporting structure thereof, in which the interspacing arrangement of the channels with the corrugated pieces arranged therein not only can make the capillary wick uniformly abutted against the inner wall faces of the casing to enhance the tightly contacting effect, but also can increase the vaporization amount of the working fluid to accelerate the heat-transferring speed and further boost the heat-conducting performance of the vapor chamber.

Problems solved by technology

Thus, a cooling device comprised of aluminum-extruding cooler and fan has already been unable to satisfy the using requirement of current CPU.

Since the transporting route of the vaporized working fluid is too long, the heat-transferring performance is very poor.

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