Heat dissipating system

Abstract

A heat dissipating system includes: a heat sink adapted to be connected to an electronic device; a coolant reservoir adapted for storing a coolant therein; a driving mechanism; a cooling mechanism; a coolant circulating conduit connected to the coolant reservoir, the cooling mechanism, the heat sink, and the driving mechanism such that the driving mechanism drives circulation of the coolant in the coolant circulating conduit; and a pressure stabilizing mechanism including a bypass connected to the coolant reservoir and the coolant circulating conduit at a position downstream of the driving mechanism, and a valve. The valve is opened when the pressure inside the coolant circulating conduit exceeds a predetermined value, thereby permitting fluid communication between the coolant reservoir and the coolant circulating conduit through the bypass.

Description

CROSS-REFERENCE TO RELATED APPLICATION [0001] This application claims priority of Taiwanese application no. 094216236, filed on Sep. 21, 2005. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] This invention relates to a heat dissipating system, more particularly to a heat dissipating system for cooling an electronic device. [0004] 2. Description of the Related Art [0005] As technology advances in the field of computers, performance of the computer has become more and more powerful. Therefore, considerable heat is generated by electronic devices, such as a central processing unit (CPU), of the computer, thereby resulting in a high temperature. The high temperature can cause improper shut down of the computer and damage to the data stored in the computer. Thus, heat dissipation is a major concern for computer manufacturers. [0006]FIG. 1 shows a conventional heat dissipating device 1 that includes a heat sink 11, a coolant 12, a driving mechanism 13, a cooling mechan...

AI Technical Summary

Benefits of technology

[0012] Therefore, the object of the present invention is to provide a heat dissipating system for cooling an electronic device, which can prevent the problem caused by excessive pressure as encountered in the prior art.

Problems solved by technology

Therefore, considerable heat is generated by electronic devices, such as a central processing unit (CPU), of the computer, thereby resulting in a high temperature.

The high temperature can cause improper shut down of the computer and damage to the data stored in the computer.

However, in the conventional heat dissipating device 1, when the driving force generated by the driving mechanism 13 is too strong, the pressure in the heat dissipating device 1 becomes too high, thereby causing damage to the heat dissipating device 1, such as breaking of the conduit 112.

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