Light emitting diode package with metal reflective layer and method of manufacturing the same

Abstract

The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.

Description

CLAIM OF PRIORITY [0001] This application claims the benefit of Korean Patent Application No. 2005-53163 filed on Jun. 20, 2005, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a Light Emitting Diode (LED) package having a metal reflective layer for focusing and emitting light through one side of the package, and a method of manufacturing the same. More particularly, the invention relates to an LED package with a metal reflective layer minimized in light loss and improved in luminance, which can be mass-manufactured as a PCB type in a small size unaffected by the size of an LED chip, and is improved in productivity. [0004] 2. Description of the Related Art [0005] In general, a mobile phone or PDA adopts a light emitting diode (LED) package in various sizes for a backlight. [0006] As the backlights are becoming slimmer, the LED ...

AI Technical Summary

Benefits of technology

[0013] Another object of certain embodiments of the invention is to provide an LED package having a metal reflective layer, which can be mass-produced without being affected by the LED chip size, and can be easily manufactured in a small size, and a method of manufacturing the same.

[0014] Further another object of certain embodiments of the invention is to provide an LED package having a metal reflective layer, which adopts Epoxy Molding Compound (EMC) transfer molding to minimize irregular color distribution and enhance uniform color development, and a method of manufacturing the same.

[0015] Yet another object of certain embodiments of the invention is to provide an LED package minimized in light loss and improved in luminance, which can be mass-produced and is improved in productivity, and a method of manufacturing the same.

Problems solved by technology

However, in such a conventional structure, the LED chip 310 is formed in a recess 322 of the substrate, and a separate sealing plate 314 covers the recess 322, and thus limiting automated manufacturing and mass-production.

However, as an additional process is required to adhere the molded part 414 on the substrate 410, the manufacturing process is not efficient in terms of productivity.

Therefore, such a conventional LED package 400 yields low-uniformity and rather mediocre color development.

Images