Radio frequency identification tag and method of making the same

Abstract

The present invention describes a process for manufacture of RFID tags. The RFID tag of the present invention includes a substrate, an antenna, and a die positioning structure disposed on the substrate that is cast and cured specifically for receiving a silicon die of the type typically used in RFID applications. The substrate is selected from a number of materials, the properties of which render it penetrable by electron beam radiation. The die positioning structure is a second material which is electron beam curable, and which is deposited and cured at high speed on the substrate in a novel fashion in accordance with the present invention in a highly efficient, reproducible and economical manner.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates generally to the field of wireless communications, and specifically to the use of radio frequency transmissions to track the movement of commercial goods, as well as other suitable applications. [0003] 2. Description of the Related Art [0004] Consumers are familiar with electronic systems for recognizing, tabulating, and indexing the movement of goods through the chain of commerce. Everyday examples include bar codes combined with optical scanners as found in a supermarket. More recently, some products and their containers have been “tagged” with radio frequency identification (RFID) transponders, which in combination with a radio frequency reader and sophisticated computer systems, enable a commercial enterprise to track inventory from a distance. An RFID system includes a tag, a reader, and a computer network connected to the reader for compiling the relevant data. [0005] RFID tags ge...

AI Technical Summary

Benefits of technology

[0011] Accordingly, the present invention includes an efficient, reliable, and high fidelity RFID tag and a method of making the same. The RFID tag of the present invention includes a substrate, upon which an antenna for receiving and transmitting radio frequency signals may be printed. The RFID tag also includes a die positioning structure disposed on the substrate that is cast and cured specifically for receiving a silicon die of the type typically used in RFID applications. The silicon die is electrically connected to the antenna through at least one bond, which enables the RFID tag to transmit, receive, and possibly update electronic data stored on the silicon die through normal RFID protocols.

[0013] The novel RFID tag of the present invention is the result of an improved method of manufacture in the RFID industry. The method includes a number of acts, including providing a substrate with an antenna printed thereon and a second material. The substrate is generally of a dielectric material and hydrophobic, and should preferably be of low stopping power for electron beam radiation. The second material is curable by electron beam radiation, and is disposed on the substrate through a pressing mechanism that forms the die positioning structure discussed above. Once the die positioning structure is cured and affixed to the substrate, a silicon die is positioned within the die positioning structure and connected to the antenna through at least one bonding point. At this time, a manufacturer may provide a radio signal receivable by the antenna to test the electrical connections of the RFID tag. Once the operability of the RFID tag is confirmed, a protective cap or coating is disposed over the silicon die and the die positioning structure to increase the resiliency and abrasive resistance of the RFID tag.

Problems solved by technology

In spite of the advantages of the passive tag, there are numerous problems encountered with their maintenance, operation, and manufacture.

In particular, given the sheer volume of commerce and the potential market for RFID tags, there are currently severe limitations in the manufacturing process that hinder the mass production of suitable tags.

The process outlined above presents a number of complications that hinder the large-scale production of RFID tags.

First, as the economic demand for RFID tags reaches into the billions of units per year, the 8-10 second UV-curing process effectively limits the supply that manufacturers can theoretically muster.

Secondly, once the die is bonded to the antenna, there is no simple method for removing the die if it fails to perform in the pre-shipment tests.

Consequently, an estimated 20-40% of the RFID tags that fail the tests are irrevocably lost, further limiting the supply and increasing the cost of tags to businesses and consumers.

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