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Light emitting diode package structure

Inactive Publication Date: 2005-01-20
LIN MING DER +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010] In view of the above-mentioned problems, an object of the present invention is to provide a light emitting diode package structure capable of packaging a light emitting diode in a relatively simple process, thereby increasing the production yield and decreasing the production cost.
[0011] Another object of the present invention is to provide a light emitting diode package structure capable of achieving a higher efficiency of a light emitting diode, thereby reducing the heat generated during operations and then enhancing the lifespan and reliability of a light emitting diode.

Problems solved by technology

Moreover, during the mounting of the light emitting diode 10 over the package base 20 in the flip-chip way, it is necessary for the metal solder balls 16 and 17 to precisely align with the first and second pads 21 and 22, resulting in a more difficult manufacture and a higher production cost.

Method used

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Examples

Experimental program
Comparison scheme
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first embodiment

[0027]FIG. 2(a) is a top plan view showing a transparent insulating carrier base 30 according to the present invention while FIG. 2(b) is a cross-sectional view showing a light emitting diode package structure taken along a line A-A′ of FIG. 2(a). Referring to FIG. 2(a), the transparent insulating carrier base 30 is formed with a recess 31 in an approximately central region thereof. The recess 31 has a bottom surface 32 and two sidewall surfaces 33a and 33b. For example, the transparent insulating carrier base 30 is made of glass. Two planar metal layers 34a and 34b, which are separated from each other, are formed in a region other than the recess 31 on the top surface of the transparent insulating carrier base 30. In addition, two metal pads 35a and 35b are formed on the planar metal layers 34a and 34b to locate in peripheral regions of the transparent insulating carrier base 30.

[0028] Referring to FIG. 2(b), the light emitting diode 10 is delivered into the recess 31 such that the...

third embodiment

[0038] When a power supply is applied to the light emitting diode 10 through the protruding metal pads 35a and 35b, the light emitting diode 10 radiates light to external space through the substrate 11 and the transparent resin 53a, as indicated by an arrow of FIG. 4. Since it is not necessary for the light to transmit through the insulating carrier base 50 to external space, the insulating carrier base 50 of the third embodiment is not limited to being made of a transparent material such as glass; it may be made of ceramic, AlN, SiC, plastic, resin, a printed circuit board, or a combination thereof. In addition, the insulating carrier base 50 may be a combination of a plurality of elements, such as a metal core body coated with an insulating material outer film.

[0039]FIG. 5 is a cross-sectional view showing a light emitting diode package structure according to a fourth embodiment of the present invention. Hereinafter only described are differences of the fourth embodiment from the ...

fifth embodiment

[0044] In the fifth embodiment, a lower resin portion 73a and an upper resin portion 73b are used for sealing all of the light emitting diode 10 and the wirings 36a and 36b. The lower resin portion 73a is made of a transparent material and serves as a light-transmitting channel. Preferably, the lower resin portion 73a is made of a material having a refraction index which matches the refraction index of the substrate 11 in such a manner that the total reflection between the substrate 11 and the lower resin portion 73a is reduced. The upper resin portion 73b may be made of a reflective material or a resin doped with a reflective material and serves to reflect the light toward the lower resin portion 73a. In addition, in order to further enhance the lighting efficiency, a reflective layer (not shown) may be coated on the upper resin portion 73b for causing the light generated from the light emitting diode 10 to be reflected toward the lower opening 52a. Moreover, an optical lens 74 may...

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Abstract

A light emitting diode package structure includes an insulating carrier base formed with a recess or a through hole. The recess or the through hole has a depth enough for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for sealing all of the light emitting diode and the two wiring lines.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional application of prior U.S. application Ser. No. 10 / 379,234, filed Mar. 3, 2003, which is pending.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a light emitting diode package structure and, more particularly, to a package structure capable of enhancing the lighting efficiency of a light emitting diode and packaging a light emitting diode in a relatively simple process, thereby increasing the production yield and decreasing the production cost. [0004] 2. Description of the Related Art [0005] For commercial and industrial applications, light emitting diodes provide a light source at a higher efficiency and a lower cost than incandescent lamps and fluorescent lamps. In recent years, a variety of package structures and methods have been developed for the light emitting diodes, such as a surface mounting type package structure and a flip-chip type package s...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/54H01L33/56
CPCH01L33/486H01L33/54H01L33/56H01L33/641H01L2224/14H01L2224/48091H01L2224/49107H01L2224/16225H01L2924/00014H01L24/05H01L2224/05568H01L2224/05573H01L2224/056H01L2224/06102
Inventor LIN, MING-DERHSU, JUNG-KUEILIN, SAN-BAO
Owner LIN MING DER
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