Flat plate heat transfer device and method for manufacturing the same

Abstract

A flat plate heat transfer device contacted with heat source and heat-emitting unit at both end transfers heat generated at the heat source to the heat-emitting unit horizontally. The device includes a thermally-conductive flat case containing a working fluid evaporated with absorbing heat from the heat source and condensed with emitting heat to the heat-emitting unit; and a mesh aggregate installed in the case so that coarse and fine meshes in which wires are woven to be alternately crossed up / down are vertically laminated in contact. The coarse mesh gives main-directional and sub-directional vapor dispersion channels with different sectional areas at each crossing point of the mesh wires for vapor to flow therethrough. The main-directional vapor dispersion channel with relatively larger sectional area is parallel to heat transfer direction. The fine mesh gives liquid flow channels along running direction of the mesh wire from each crossing point of the mesh wires.

Description

[0001] The present invention relates to a flat plate type heat transfer device capable of dissipating heat from a heat source by circulating a working fluid by evaporation and condensation, and a manufacturing method thereof, and more particularly, the present invention relates to such a A flat-plate heat transfer device and a manufacturing method thereof, which can prevent a flat-type container from breaking and provide vapor distribution channels and liquid flow channels in directions that ensure maximum heat transfer efficiency. Background technique [0002] Recently, electronic devices such as notebooks or PDAs have become smaller and thinner with the development of integration technology. In addition, as demands for higher responsiveness and function expansion of electronic devices increase, power consumption also tends to increase. Then, a large amount of heat is generated from electronic components inside the electronic equipment while the equipment is in operation, so ...

AI Technical Summary

Problems solved by technology

However, it is not easy to have sufficient vapor distribution passages in a flat container having a small thickness of a flat heat transfer device

In particular, since the flat-plate type container is kept in a vacuum state (or decompressed state), the upper and lower flat plates of the container are easily broken or deformed during its manufacturing process, thereby reducing the reliability of the product

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