Alignment detection structure and alignment offset detection method

Abstract

The invention relates to an aim detecting structure, which comprises an aim picture on the basic plate, and a frame with known width on the periphery of said picture. The invention can be used in COG (Chip-On-Glass) technique, that with the aim mark of chip, after COG pressing, judging the deflection amount via the relative position of aim mark and the frame; therefore, the invention can directly calculate the deflection after compressing chip to adjust the machine after COG process.

Description

technical field [0001] The present invention relates to an alignment detection structure and a detection method for alignment offset, and in particular to a substrate that can be used to detect chip pressing deviation after the chip is pressed in the COG (Chip-On-Glass) process. Alignment detection structure of displacement and method for detecting displacement thereof. Background technique [0002] Generally, the driving method of liquid crystal display is driven by the driver chip (IC), and some of the driver chips are pressed to the corresponding position on the substrate accurately through the high-temperature and high-pressure lamination process, so there will be The alignment action, and the alignment method is through the corresponding mechanisms on the chip and the substrate, and then presses after alignment. However, in the process of pressing, there will inevitably be mechanical or human errors, resulting in misalignment and deviation. Therefore, it is necessary t...

AI Technical Summary

Problems solved by technology

However, in the process of pressing, there will inevitably be mechanical or human errors, resulting in misalignment and deviation, so it is necessary to observe the deviation and re-adjust the machine

[0003] figure 1 It is a traditional method for detecting and evaluating the offset status of the glass substrate and chip bonding in the COG process. It uses a microscope to directly observe the position of the alignment mark on the opposite substrate after the chip is bonded in the COG process. Although the alignment mark on the chip The alignment mark 1 and the alignment mark 2 on the substrate have a fixed length and width between them, but if there is a deviation after the chip is pressed, because the two alignment marks are not completely sealed Therefore, when the offset occurs, we can only make a rough estimate to estimate the offset status, and cannot know the amount of offset clearly.

This method can only roughly estimate the possible offset direction and amount of the machine in the COG process. Therefore, when adjusting the offset of the machine, it can only be adjusted in a rough way, often requiring multiple adjustments to get accurate results

[0004] In addition, in the prior art, there is another method for evaluating the offset state of the bonding between the glass substrate and the chip in the COG process, which is applied to the bonding detection of the contact pad of the glass substrate and the bump of the chip. During detection, the side The glass substrate is irradiated to the light source, and the reflected light from the pressing area, the offset area and the non-pressing area have different brightness to judge the offset between the glass substrate and the chip. The disadvantage of this method is still Calibrate with a rough estimate of the offset, and use the brightness of the reflected light to judge the offset and must go through the conversion process to evaluate the result, so it is a relatively complicated detection method

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