Chemical bronze plating liquid of mixing type non-formaldehyde reducer

Abstract

The invention relates to a chemical bronze plating liquid of mixing type non-formaldehyde reducer for electronic printing circuit board, wherein the constituents include copper sulfate, EDTA, reducing agent and stabilizing agent, the reducing agent is prepared by mixing two non-formaldehyde reducing agents, which can be hypophosphites, glyoxylic acid and methyl aldehyde addition compound, any two of them can be combined. The advantages of the non-formaldehyde reducing agent include reduced environmental pollution, fast rate of deposition, high copper sedimentary deposit, and good copper deposition compactness.

Description

technical field [0001] The invention relates to an electroless copper plating solution, in particular to an electroless copper plating solution for circuit boards in the electronic industry. Background technique [0002] With the rapid development of the modern electronic industry, the application fields of circuit boards are omnipresent, from some small daily necessities to the aerospace industry. With the development of the electronics industry, the technology of manufacturing circuit boards is also changing with each passing day. Many manufacturers of circuit boards have invested a lot of manpower and material resources in research. Only in the electroless copper plating solution has achieved a lot of results. There are many new products. The traditional electroless copper plating process uses formaldehyde (HCHO) as a reducing agent, and EDTA and potassium sodium tartrate as a single or mixed complexing agent. There are still many problems in this electroless copper pla...

AI Technical Summary

Problems solved by technology

[0003] (1) Formaldehyde smells bad, has carcinogenic effect, and causes serious environmental pollution;

[0004] (2) The performance of the coating is due to its inclusion of H 2 、Cu 2 O, C, N and other impurities are poor;

[0005] (3) The electroless copper plating solution with formaldehyde as a reducing agent must be highly alkaline to react effectively, thereby easily causing corrosion of the plated body;

[0006] (4) The stability of the plating solution is not good enough, and the copper chemical deposition rate is low

However, sodium borohydride and dimethylaminoborane are expensive, and hydrazine is highly toxic

[0009] It is reflected from the above many patents that they have a commonality, that is, in their technical solutions for non-formaldehyde copper precipitation, only a single reducing agent is used. Because a single reducing agent often has defects, many researchers currently have Be engaged in the research of non-formaldehyde reductant electroless copper plating solution, but also still be engaged in the research of these single reductants, although have improved to some extent, still exist above-mentioned shortcoming and can't fundamentally solve