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Flexible copper-coated laminated board and mfg. method

A laminated board, copper-clad technology, applied in the direction of printed circuit manufacturing, chemical instruments and methods, layered products, etc.

Inactive Publication Date: 2005-10-05
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this technology is restricted in the design of copper-clad laminated boards. Therefore, a flexible copper-clad laminate that satisfies the above-mentioned ductility, bending resistance, and fine-grained properties without adjusting the thickness of the copper foil is expected. Laminate Development

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0034]In a reaction vessel equipped with a thermocouple, a stirrer and a nitrogen introduction device, N,N-dimethylacetamide (DMA) was added as a solvent. Add 4,4'-diamino-2,2'-dimethylbiphenyl (DADMB) and 1,3-bis(4-aminophenoxy)benzene (BAB) into the reaction vessel, stirring to dissolve . Next, add 3,3',4,4-diphenyltetracarboxylic dianhydride (BPDA) and pyromellitic anhydride (PMDA). The feeding amount is as follows: the total amount of monomer input is 15wt%, the molar ratio of each diamine (DADMB:BAB) is 90:10, and the molar ratio of each acid anhydride (BPDA:PMDA) is 20:79. Then, stirring was continued for 3 hours, and the viscosity of the obtained polyimide precursor resin solution was 20000 cps.

Synthetic example 2

[0036] 2,2-bis[4-(4-aminophenoxy)phenyl]propane was added to the reaction vessel in which DMA had been added, and dissolved while stirring. Then, BPDA and PMDA were added. The total amount of monomer input is 15%, and the molar ratio of each acid anhydride (BPDA:PMDA) is 4:69. Then, stirring was continued for 3 hours, and the viscosity of the obtained polyimide precursor resin solution was 5000 cps.

Embodiment 1

[0038] BHY-HA foil (thickness 18 μm) manufactured by Nippon Mining Metal Co., Ltd. was used as the copper foil, and the polyimide precursor resin solution obtained in Synthesis Example 2 was coated on the copper foil, dried, and then coated The polyimide precursor resin solution that synthetic example 1 obtains, dry, then coat the polyimide precursor resin solution that synthetic example 2 obtains on it, dry, so just obtained by polyimide precursor resin A laminate formed on a copper foil layer.

[0039] The laminate was put into a drying oven and heat-treated at 360° C. for 3 minutes to obtain a single-sided copper-clad laminate with a polyimide precursor resin thickness of 25 μm. The modulus of elasticity of the copper foil before the heat treatment was 62 GPa, the modulus of elasticity of the copper foil after the heat treatment was 17 GPa, and the ratio of the moduli of elasticity was 3.6.

[0040] The result of the folding test of the obtained flexible copper-clad lamina...

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PUM

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Abstract

PROBLEM TO BE SOLVED: To provide a flexible copper-clad laminate which can be easily handled during manufacturing a copper-clad laminate without thinning a copper foil; and shows high pliability, successful bending properties and a high stress relaxation effect after molding. SOLUTION: In the flexible copper-clad laminate with a copper foil layer formed on one surface or both surfaces of a polyimide resin layer through a heat treatment process, the modulus of elasticity (p2) of the copper foil layer before heat treatment is 50 to 80 GPa and the ratio (p2 / p3) of the modulus of elasticity (p2) before heat treatment to the modulus of elasticity (p3) after heat treatment at higher than 300°C is 3.5 to 5.5. COPYRIGHT: (C)2006,JPO&NCIPI

Description

technical field [0001] The invention relates to a flexible copper-clad laminate, especially a flexible copper-clad laminate with excellent bending resistance. Background technique [0002] [Patent Document 1] JP-A-2001-58203 [0003] [Patent Document 2] Patent No. 3009383 [0004] Flexible copper-clad laminates are widely used in electronic devices that require flexibility, flexibility, and high-density installation. In recent years, with the increase of device memory capacity, the narrow pitch of wiring, and the continuous upgrading of high-density mounting, the requirements for the mechanical properties of laminated boards have also increased. In measures to narrow the pitch of flexible copper-clad laminates, electrolytic copper foil is generally considered to be better due to the characteristics of the copper foil manufacturing method. On the other hand, in the recent high-density installation, the bending portion when bending the laminated board and storing it in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B21B1/24H05K1/09H05K3/02
CPCA62C31/28A62C35/68A62C37/14
Inventor 服部公一财部妙子
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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