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Micro fluid jet unit and method of improving micro fluid jetting quality

A spraying device and microfluidic technology, applied in printing devices, printing, etc., can solve problems such as printing quality degradation

Inactive Publication Date: 2005-09-28
BENQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In fact, the heaters in the inkjet chip may have different resistance values ​​due to process factors. After a period of use, the printing defects caused by the differences in the resistance values ​​of the heating elements will become more and more obvious. , leading to a decrease in print quality

Method used

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  • Micro fluid jet unit and method of improving micro fluid jetting quality
  • Micro fluid jet unit and method of improving micro fluid jetting quality
  • Micro fluid jet unit and method of improving micro fluid jetting quality

Examples

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Effect test

no. 1 example

[0036] Figure 4 is a schematic block diagram showing the first embodiment of the present invention. According to the aforementioned test results, before fluid injection, a preferred embodiment of the present invention is to first measure the distribution range of the resistance value of each heater in the microfluid injection device, and if it meets the preset specification range, start Originally set standard driving conditions. If not, adjusting driving conditions for all heaters of the microfluid ejection device to improve ejection quality. see Figure 4 After measuring the distribution range of the resistance value of each heater in the microfluid ejection device, the heater 5 with abnormal resistance value and the heater 6 with normal resistance value are obtained. The driving condition 7 is adjusted for all the heaters of the micro-fluid ejection device, and the ejection action is performed to improve the ejection quality of the micro-fluid ejection device.

no. 2 example

[0038] Figure 5 is a schematic block diagram showing a second embodiment of the present invention. In this embodiment, if the driving conditions are adjusted for all the heaters of the microfluid ejection device to improve the ejection quality according to the aforementioned test results. Although the preferred injection efficiency can be maintained, in the case of prolonging the heating time, abnormal injection conditions will occur in the heaters that originally sprayed normally. Therefore, before fluid injection, another preferred embodiment of the present invention is to first measure the resistance value of each heater in the microfluid injection device, and only adjust the driving conditions for heaters that exceed the standard, so as to improve the injection quality. see Figure 4 After measuring the distribution range of the resistance value of each heater in the microfluid ejection device, the heater 5 with abnormal resistance value and the heater 6 with normal res...

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Abstract

The present invention provides one kind of micro fluid jet unit and the method of improving micro fluid jetting quality. One resistor sensing unit is used in the resistance detection of the heater in the micro fluid jet unit, and one signal control unit is used for regulating the driving signal based on the detection result, so as to improve micro fluid jetting quality and raise the use performance of the micro fluid jet unit.

Description

technical field [0001] The present invention relates to a micro-fluid ejection device and a method for improving the quality of micro-fluid ejection, in particular to a method for detecting the resistance value of a heating device in a micro-fluid ejection device and adjusting the output drive signal to improve the quality of micro-fluid ejection Methods. Background technique [0002] At present, fluid ejection devices are mostly used in components such as inkjet heads and fuel injectors, among which inkjet heads are mostly designed with thermal bubble driving. [0003] figure 1 A conventional single-substrate fluid ejection device 1 of U.S. Patent No. 6,102,530 is shown, which uses a silicon substrate 10 as a body, and forms a structural layer 12 on the silicon substrate 10, and between the silicon substrate 10 and the structural layer 12 A fluid cavity 14 is formed to accommodate a fluid 26; and a first heater 20 and a second heater 22 are arranged on the structural laye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/04B41J2/14B41J29/393
Inventor 周忠诚徐聪平刘玟成游正弘吴尚羲
Owner BENQ CORP
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