Composition for heat conductive siloxanes heat release and its using method

A technology of thermal conductivity and composition, which is applied in chemical instruments and methods, semiconductor devices, and other chemical processes, can solve the problems of high stress of exothermic electronic parts, damage and difficulties of exothermic electronic parts, and achieve good discharge The effect of thermal properties

Inactive Publication Date: 2005-08-03
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] When there is a wide gap between the electronic component and the heat sink, it is difficult for the grease to apply an amount to fill the gap, and even if it can be applied, there is a problem that it cannot maintain the shape and flow out
[0007] In addition, the gap can be easily filled by using a rubber sheet, but when the gap between the electronic part and the heat-radiating part is narrowed due to ambient temperature or vibration, excessive stress will be generated on the heat-radiating electronic part, and the Damage to exothermic electronic parts

Method used

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  • Composition for heat conductive siloxanes heat release and its using method
  • Composition for heat conductive siloxanes heat release and its using method
  • Composition for heat conductive siloxanes heat release and its using method

Examples

Experimental program
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Effect test

Embodiment 1

[0055] will have 10000mm 2 Viscosity per s, 100 g of dimethyl polysiloxane (Vi group content: 0.00525 mol / 100 g) with vinyl groups at both ends, and 500 g of alumina with an average particle diameter of 1 μm are charged into a Shinagawa-style universal mixer, and mixed for 60 Minutes later, 0.2 g of a 2-ethylhexanol solution of chloroplatinic acid (2.0% by mass of platinum element), 4.0 g of a toluene solution of ethynylcyclohexanol (50% by mass) as a reaction control agent, and the following 5.0 g of organohydrogenpolysiloxane (Si-H group amount: 0.00184 mol / g) represented by formula (7), mixed for 10 minutes for each additive, and finally mixed for 10 minutes under a reduced pressure of -700mmHg, Composition a is obtained.

[0056]

Embodiment 2

[0062] will have 10000mm 2 Viscosity per s, 100 g of dimethyl polysiloxane (Vi group content: 0.00525 mol / 100 g) with vinyl groups at both ends, and 500 g of alumina with an average particle diameter of 1 μm are charged into a Shinagawa-style universal mixer, and mixed for 60 Minutes later, 0.2 g of a 2-ethyl-hexanol solution of chloroplatinic acid (the amount of platinum element is 2.0% by mass), 4.0 g of 3-methyl-1-butyn-3-ol as a reaction control agent, and the above 5.0 g of the organohydrogenpolysiloxane represented by the formula (7) was mixed for 10 minutes with respect to each additive, and finally mixed for 10 minutes under a reduced pressure condition of -700 mmHg to obtain a composition d.

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Abstract

A thermally conductive silicone composition for heat radiation comprises an organopolysiloxane (a) having an alkenyl group, a thermally conductive filler (b), an organohydrogenpolysiloxane (c) having two or more Si-H groups in average in a molecule, a platinum-family metal-based addition reaction catalyst (d) and a volatile reaction regulator (e) containing an aliphatic unsaturated group, where the group (e) volatilizes from the surface at the curing thereby causing curing of the surface part but the inner part remaining uncured. The quantity of the organohydrogenpolysiloxane (c) is one where the molar ratio of SiH group in (c) / alkenyl group in (a) is >0.6 and <10.0. The quantity of the regulator (e) is one where the molar ratio of SiH group in (c) / [alkenyl group in (a)+unsaturated group in (e)] is 0.05-0.5. The thermally conductive silicone for heat radiation exhibits good heat radiation properties, which does not droop down, does not come off from a radiating body even on displacement of a gap, and does not exert excessive stress on the radiating body, in case that the composition is filled in the displaceable gap between the radiating body and a heat-dissipation member and heated to effect surface curing.

Description

technical field [0001] The present invention relates to a siloxane exothermic composition mixed with a thermally conductive filler, and particularly relates to a composition for exothermic components mounted on a thermal interface of an exothermic electronic component, a heat sink or a circuit board, etc. for exothermic heat dissipation of an exothermic electronic component Effective thermally conductive silicone exothermic compositions and methods of use thereof. Background technique [0002] Electronic components such as CPUs, excitation ICs, and memories used in electronic equipment generate a large amount of heat themselves due to high performance, high speed, miniaturization, and high integration. . Therefore, various heat radiation methods and heat radiation components used therein for suppressing temperature rise of electronic parts during operation have been proposed. [0003] Conventionally, in electronic devices and the like, in order to suppress temperature rise...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/10C08K3/00C08K5/05C08L83/04C08L83/05C08L83/07H01L23/373
Inventor 朝稻雅弥
Owner SHIN ETSU CHEM IND CO LTD
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