Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and equipment for breaking down and reclaiming electronic components and solder of discarded circuit board

A technology of electronic components and recycling methods, which is applied in the field of dismantling and recycling of electronic components and solder of waste circuit boards, and the field of devices, which can solve problems such as high operating costs, low efficiency of dismantling and recycling, and complex system structures

Inactive Publication Date: 2005-03-30
张杰
View PDF1 Cites 53 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods generally have some problems, mainly for some circuit boards, especially for circuit boards with a large number of perforated components, the efficiency of device dismantling and recycling is very low
At the same time, there are problems of complex system structure and high operating costs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and equipment for breaking down and reclaiming electronic components and solder of discarded circuit board
  • Method and equipment for breaking down and reclaiming electronic components and solder of discarded circuit board
  • Method and equipment for breaking down and reclaiming electronic components and solder of discarded circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Description of the main technological process of this set of equipment:

[0015] Discarded circuit boards are screened and sorted through a series of pre-processing mechanisms (not shown), some sundries are removed, and the circuit boards are cleaned and dried as necessary before entering Figure 1 The shown preheating and heating device. The purpose of setting up the device is to melt and bond the solder alloy of the electronic components, so as to carry out the subsequent component disassembly and recovery of components and solder. The heating method of the device is not particularly limited, as long as the circuit board can be uniformly heated at the end of the device to a temperature above the melting point of the solder (when the solder contains eutectic components, the temperature is 183°C) and maintained, so that the solder is evenly melted and kept in a molten state That's it. The temperature setting of the preheating and heating device should be adjustable, an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for detaching and recovering the electronic elements and solder from the rejected circuit board includes uniformly heating said circuit board until the solder is molten, sucking the electronic elements from the molten solder, and solidifying the solder.

Description

technical field [0001] The invention relates to a method and device for dismantling electronic components mounted on waste printed circuit boards and realizing recycling of electronic components and solder alloys through the design of technological processes. This method is applicable to the processing of circuit boards soldered by all electronic components at present, including both surface mount components and perforated components. Background technique [0002] In modern society, printed circuit boards equipped with electronic components are widely used in all aspects of our social production and life, such as control boards of household appliances, computer motherboards, etc., and there is a trend of wider and wider applications. With the damage, update or repair of the circuit boards of various equipment, a large number of waste printed circuit boards enter the urban environmental system and become electronic waste. These electronic wastes contain a large amount of toxi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B09B3/00H05K1/00
CPCY02W30/82
Inventor 张杰
Owner 张杰
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com