High-frequency throwing structure

Abstract

Disclosed is a high frequency throwing structure, mainly comprising multi-throwing pads on the end chip with multi-throwing pads and multi-throwing pads on the end of seal agent. Its characteristics is that, the connecting type of high efficiency signal is on multi-throwing pads on the end of chip has the output two near adjacent multi-throwing pads to the seal agent in parallel method, and the connecting type of earthling signal is high frequency signal which has two earthling loop nearby, especially a multi-throwing pads on the end of seal agent is shared by two adjacent multi-throwing pads for output of high frequency signal. So the invention can avoiding too fewer distance between throwing, and can acquire good match of capacitance and inductance each other between chip and with good electric specification.

Description

technical field [0001] The invention relates to a high-frequency wire bonding structure, in particular to a high-frequency wire bonding structure used in metal frame packaging or lead frame packaging. Background technique [0002] In radio frequency circuits or high-speed circuits, in the high-frequency bonding structure, although the high-frequency signal bonding pads are often surrounded by grounding signal bonding pads on both sides of the chip end, and multi-point grounding is provided on the package, so that The electrical characteristics between the chip and the package can be better. But in this case, there are dense distribution of metal wires in the narrow space of the high-frequency wire bonding structure, so when the metal wires are wire-bonded, there will be troubles in the wire spacing, wire arc height, and wire layout. [0003] And when the high-frequency wire-bonding structure puts an adhesive film on the package to cover the chip and the metal wires, too den...

AI Technical Summary

Problems solved by technology

[0008] However, such an improvement of the high-frequency wire bonding structure 100 is difficult to implement.

For example, the bonding area between the bonding pad 133 and the pin 140 is actually not large, so the two bonding wires between the bonding pad 133 and the pin 140 must be very close, and it is difficult to implement when bonding. In the future, when the adhesive film is applied, the adhesive film will easily make two dozen wires contact and produce adverse effects

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