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RF transceiver module formed in multi-layered ceramic

A radio frequency transceiver module, radio frequency transceiver technology, applied in the direction of electrical components, circuits, transmission systems, etc., can solve the problems of increasing the difficulty of adjusting and correcting radio frequency communication modules, high circuit connection complexity, large circuit area, etc., to achieve low assembly Cost, ease of adjustment and correction, and the effect of fewer circuit parts

Inactive Publication Date: 2005-02-09
CHI MEI COMM SYST INC
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  • Summary
  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

However, the receiver 16 and the transmitter 20 are still separately formed modules, so the separate arrangement of the receiver 16 and the transmitter 20 results in a larger circuit area, higher circuit connection complexity, and increased adjustment and calibration radio frequency communication modules 30 difficulty

Method used

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  • RF transceiver module formed in multi-layered ceramic
  • RF transceiver module formed in multi-layered ceramic
  • RF transceiver module formed in multi-layered ceramic

Examples

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Embodiment Construction

[0026] Please refer to figure 2 and image 3 , image 3 It is a functional block diagram of the radio frequency communication module 40 of the present invention. The radio frequency communication module 40 of the present invention and figure 2 The main difference of the conventional radio frequency communication module 30 shown is that the radio frequency communication module 40 integrates the radio frequency transceiver integrated circuit 42 in the radio frequency transceiver module 44, and the radio frequency transceiver integrated circuit 42 combines the receiver 16 and the transmitter 20 in the conventional radio frequency communication module 30 . The radio frequency communication module 40 includes a radio frequency transceiver module 44 and a plurality of power amplifiers 22 . In addition, the radio frequency transceiver module 44 includes an antenna switch 12 , a plurality of surface acoustic wave filters 14 and a radio frequency transceiver integrated circuit 42 ...

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Abstract

An RF transceiver module for wireless communication devices includes a multi-layered substrate, an RF transceiver IC mounted on the multi-layered substrate for receiving and transmitting voice or data signals, at least one band selection filter mounted on the multi-layered substrate for filtering received RF signals, an antenna switch integrated in the multi-layered substrate which can be switched to transmit RF signals generated by the power amplifiers to the external antenna or to receive RF signals from an external antenna to the RF transceiver IC through the band selection filter, a plurality of passive devices embedded in the multi-layered substrate, and wiring embedded in the multi-layered substrate for electrically connecting the passive devices, the RF transceiver IC, and the band selection filter.

Description

technical field [0001] The invention provides a radio frequency transceiver module, in particular to a radio frequency transceiver module formed of multilayer ceramics and having a radio frequency transceiver integrated circuit (Integrated Circuit, IC). Background technique [0002] Radio Frequency (RF) communication modules are usually used in wireless communication devices such as mobile phones. The radio frequency communication module can send and receive wireless signals through multiple frequency bands, among which the radio frequency communication module with dual frequency and triple frequency is the most common. Please refer to figure 1 , figure 1 It is a functional block diagram of the radio frequency communication module 10 of a conventional wireless communication device. The radio frequency communication module 10 includes an antenna switch (antenna switch) 12 , a plurality of surface acoustic wave (Surface Acoustic Wave, SAW) filters 14 and a receiver (receive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/38
CPCH04B1/38
Inventor 黎克迈林佑生刘建昌
Owner CHI MEI COMM SYST INC
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