Electron beam processing apparatus

Abstract

Provided is an electron beam processing device capable of preventing deviation of an ion beam to the center, and of keeping a cooling effect of an acceleration grid. This electron beam processing device is equipped with: a plasma generation chamber 1; a shielding grid 2 mounted on the front surface of an opening of the plasma generation chamber; the acceleration grid 3 disposed in front of the shielding grid with a space; and a cooling jacket 5 mounted on the front surface of the acceleration grid 3 and having an opening 5a wider than a range where fine pores 3a of the acceleration grid 3 are formed. By forming the opening 5a of the cooling jacket 5 into a shape gradually expanded toward the traveling direction of the ion beam, an equipotential line is set nearly parallel to the acceleration grid 3, so that deviation of the ion beam to the center can be restrained and the cooling effect to the acceleration grid 3 can be kept.

Description

Technical field [0001] The invention relates to an electron beam processing device for etching with ion beams. Background technique [0002] [Patent Document 1] JP 2002-75232 A [0003] In the past, electron beam processing devices that use ion beams to trim metal films or oxide films formed on electronic components such as piezoelectric resonators to adjust their electrical characteristics have been widely known. [0004] figure 1 To show the basic principle of an electron beam processing device that generates an electron beam. In the figure, 1 is a plasma generation chamber, 2 is a screen grid with multiple pores 2a, 3 is an acceleration grid with multiple pores 3a corresponding to the pores 2a of the screen grid 2, and 4 is The accelerating grid base of the accelerating grid 3 is maintained. The outer periphery of the screen grid 2 is fixed to the plasma generation chamber 1, the outer periphery of the acceleration grid 3 is fixed to the acceleration grid base 4, and the acc...

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Problems solved by technology

[0012] However, in this case, since the contact area between the cooling jacket 5 and the acceleration grid 3 is reduced, there is a disadvantage that the acceleration grid 3 cannot obtain a sufficient cooling effect.

Especially since the inner edge of the opening of the cooling jacket 5 is far away from the porous part 3a of the acceleration grid 3 with the highest temperature, the cooling effect is reduced.

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