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Additive for adhesive and adhesive composition

A binder and additive technology, used in non-polymer binder additives, binder additives, adhesives, etc., can solve the problems of whitening of the bonding part, time-consuming, residual bubbles, etc.

Inactive Publication Date: 2004-06-30
MITSUBISHI RAYON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, for the bonding using the above-mentioned polymeric adhesive composition, it takes a long time to bond, it is necessary to carry out pre-work preparations such as preventing the leakage of the polymeric adhesive composition, and it is necessary to remove the Disadvantages such as time-consuming cleaning of sealing materials, etc.
In addition, for bonding using a solvent adhesive composition, when the acrylic resin plates are bonded to each other, the bonded part is whitened, or there is a sink mark (ヒケ, shrink) caused by evaporation of the solvent from the bonded part. mark), residual bubbles and other shortcomings

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] After fully mixing 21 parts by mass of diacetone alcohol, 21 parts by mass of cyclohexanol, 30 parts by mass of 2-ethoxyethyl acetate, and 21.5 parts by mass of methanol, add 6.5 parts by mass of water , stirring, to obtain additives for binders.

[0026] Mix the above-mentioned adhesive additives and dichloromethane at a mass ratio of 1:2 to make an adhesive composition, fix two transparent acrylic resin plates with a thickness of 3 mm in an L shape, and pour them into the gap with a syringe for bonding agent composition.

[0027] In air at a room temperature of 23°C, the bonding can be completed after 3 minutes of fixation, and there is no defect of whitening or sink marks at the bonded part. When the same operation is carried out in an environment of 30°C, it can be fixed in 2 minutes, and the defects of whitening and sink marks do not occur in the bonding part.

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PUM

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Abstract

The adhesive composition comprises an additive for adhesive composed of (a) >=10 mass% and <=30 mass% water-soluble ketone, (b) >=10 mass% and <=30 mass% high boiling point alcohol, (c) >=20 mass% and <=40 mass% high boiling point ester and (d) >=10 mass% and <=10 mass% low boiling point alcohol and (e) >=3 mass% and <=10 mass% water, and a solvent type adhesive. The water-soluble ketone (a) is preferably diacetone alcohol and the high boiling point alcohol (b) is preferably cyclohexanol and the high boiling point ester (c) is preferably 2-ethoxyethyl acetate and the low boiling point alcohol (d) is preferably methanol.

Description

technical field [0001] The present invention relates to an additive for binders and a binder composition. Background technique [0002] When acrylic resin plates are bonded to each other and used for displays, etc., as the adhesive, a polymeric bonding adhesive composed of a slurry containing methyl methacrylate and a polymeric adhesive for acrylic resin products composed of water and an organic solvent are used. The adhesive composition is well known (see JP-A-50-69144). [0003] In addition, a solvent adhesive composition obtained by mixing a halogenated hydrocarbon and cyclohexanol is also known as an adhesive between acrylic resin plates (see JP-A-50-109934). [0004] However, for the bonding using the above-mentioned polymeric adhesive composition, it takes a long time to bond, it is necessary to carry out pre-work preparations such as preventing the leakage of the polymeric adhesive composition, and it is necessary to remove the It also takes time to clean the sealin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/00C09J11/06
Inventor 恩田智士
Owner MITSUBISHI RAYON CO LTD
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