Plastic package base, air cavity type package and their manufacturing methods

Abstract

A plastic package base, an air cavity type plastic package, and their manufacturing methods, which are capable of realizing the advantages of a ceramic package in that it has a compact size, makes less noise, and is highly thermally resistant, are provided. The plastic package base includes: a first lead frame including at least one first unit body comprising a first pad required for chip bonding and first leads acting as internal terminals, arranged around the first pad and spaced a predetermined distance away from the first pad; a second lead frame including at least one second unit body comprising a second pad and second leads acting as external terminals and bonded to the first lead frame so that the second pad and the second leads correspond to the first pad and first leads of the first lead frame; and a plastic body mold-shaped in spaces between the first and second lead frames so that the top surfaces of the first leads, the top surface of the first pad, the bottom surfaces of the second leads, and the bottom surface of the second pad are exposed on the surfaces of the plastic body and the top surface of the plastic body is not higher than the top surfaces of the first leads.

Description

technical field [0001] The present invention relates to a package accommodating a semiconductor chip therein, and more particularly to a plastic package substrate, an air cavity type package accommodating a semiconductor chip in an air cavity, and a manufacturing method thereof. Background technique [0002] Packages that house electrical or electronic devices, such as semiconductor devices, are divided into two different types, including ceramic packages and plastic packages. A ceramic package is an air cavity type package generally formed by filling the inside of the package with air in order to prevent the active surface of an electric or electronic device chip mounted therein from contacting the material of the package, while a plastic package is generally not an air cavity type. For devices with weak physical characteristics (due to contact with packaged materials, the expected functions and characteristics of such devices will be seriously degraded), electrically sensi...

AI Technical Summary

Problems solved by technology

However, since each wall of the air cavity becomes thick after two molding processes for forming the first and second plastic bodies 44b and 44a are performed, the air cavity type plastic package cannot meet the demand for miniaturization of the package.

In addition, existing air cavity type plastic packages have other problems such as weak adhesion strength at the interface between the first plastic body 44b and the second plastic body 44a, increased number of molds, and expensive development costs.

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