LED module for signaling devices
A component and equipment technology, applied in the field of light-emitting diode components, can solve the problems of inflexible LED matrix and inability to use multiple lenses
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[0024] Description of preferred embodiments
[0025] According to the first configuration of LED assembly of the present invention comprises figure 1 The thin plate 1 and the light substrate 2 in the cross-sectional view are shown. The sheet 1 is provided with a plurality of LEDs 10 arranged in a matrix of LED rows. In order to improve the heat dissipation of the LEDs, the sheet metal 1 is preferably formed from a metal plate, thereby increasing the luminous efficiency of the LEDs. Preferably, the LEDs are mounted on the thin board 1 by surface mount method (SMT). The LED10 can be manufactured according to SIEMENS SMT-TOPLED regulations approved by the German state. It is required that the circuit structure formed by the LED 10 is composed of a plurality of independent circuit branches that are not related to each other. This guarantees a high fail-safety of the assembly, for example, by connecting independent circuit branches each consisting of 15 LEDs 10 in parallel so t...
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Abstract
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Application Information
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