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Wafer carrier structure for chemical and mechanical grinder

A technology of grinding device and chemical machinery, applied in grinding device, abrasive surface adjusting device, positioning device, etc., can solve the problems of occupying space of chemical mechanical grinding machine, difficult maintenance, complicated structure of grinding pad adjuster, etc., and achieve cost saving The effect of manpower, simplification of consumables, and effective utilization

Inactive Publication Date: 2007-05-09
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the wafer carrier and the polishing pad adjuster of the known chemical mechanical polishing device are separated, and occupy the space of many chemical mechanical polishing machines.
And the structure of known polishing pad adjuster is complicated, maintenance is difficult

Method used

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  • Wafer carrier structure for chemical and mechanical grinder
  • Wafer carrier structure for chemical and mechanical grinder
  • Wafer carrier structure for chemical and mechanical grinder

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0042] As shown in FIG. 3 and FIG. 4 , they are schematic diagrams illustrating the structure of the wafer carrier of the chemical mechanical polishing device according to the first embodiment of the present invention.

[0043] Please refer to Fig. 3, the structure of the wafer carrier 300 of the present embodiment includes: a grinding head 301 and a grinding pad regulator 308, wherein a wafer 302 is fixed on a wafer edge pressing ring 307 at the bottom of the grinding head 301 inside, while the polishing pad adjuster 308 is fixed on the surface of the wafer edge pressing ring 307 . Wherein the structure of the wafer carrier 300 also includes a wafer carrier attached with an elastic porous carrier film (not shown), so as to press the wafer 302 into the wetted carrier film to fix the wafer 302 . Another wafer carrier 300 structure also includes a vacuum hole (not shown), using a vacuum negative pressure to hold the wafer 302, and injecting nitrogen positive pressure during gri...

no. 2 example

[0048] As shown in FIG. 5 and FIG. 6 , they are schematic diagrams showing the structure of the wafer carrier of the chemical mechanical polishing device according to the second embodiment of the present invention.

[0049]Please refer to Fig. 5, the structure of the wafer carrier 400 of the present embodiment includes: a grinding head 401 and a grinding pad regulator 408, wherein a wafer 402 is fixed on a wafer edge pressing ring 407 at the bottom of the grinding head 401 Inside, the polishing pad regulator 408 is connected to the side of the polishing head 401 , and a brush surface 405 of the polishing pad regulator 408 is parallel to the surface of the wafer edge pressing ring 407 . Wherein the structure of the wafer carrier 400 also includes a wafer carrier attached with an elastic porous carrier film (not shown), so as to press the wafer 402 into the wetted carrier film to fix the wafer 402 . Another structure of the wafer carrier 400 also includes a vacuum hole (not sho...

no. 3 example

[0054] As shown in FIG. 7 and FIG. 8 , they are schematic diagrams illustrating the structure of a wafer carrier of a chemical mechanical polishing device according to a preferred embodiment of the present invention.

[0055] Referring to FIG. 7 , the structure of the wafer carrier 500 of this embodiment includes: a polishing head 501 and a polishing pad adjuster 508 . One of the wafers 502 is fixed inside a wafer edge pressing ring 507 at the bottom of the grinding head 501 , and the polishing pad adjuster 508 is embedded on the surface of the wafer edge pressing ring 507 . Wherein the structure of the wafer carrier 500 also includes a wafer carrier attached with an elastic porous carrier film (not shown), so as to press the wafer 502 into the wet carrier film to fix the wafer 502 . Another structure of the wafer carrier 500 also includes a vacuum hole (not shown), using a vacuum negative pressure to hold the wafer 502, and injecting a nitrogen positive pressure during grind...

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PUM

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Abstract

The wafer carrier structure for chemical and mechanical grinder includes a grinding head and a grinding mat regulator, the grinding head has a bottom and a wafer edge pressing down ring to fix the wafer in the bottom of the grinding head, and the grinding mat regulator is fixed to the surface of the wafer edge pressing down ring, around the side of the grinding head or embedded into the surface of wafer edge pressing down ring, so as to combine with the grinding head to form one integral unit.

Description

technical field [0001] The present invention relates to a chemical mechanical polishing (CMP) device, and in particular to a wafer carrier (Wafer Carrier) structure of the chemical mechanical polishing device. Background technique [0002] Chemical mechanical polishing is the only technique available today that provides comprehensive planarization. The principle of planarization is to use a mechanical principle similar to sharpening a knife, and cooperate with an appropriate chemical reagent (Reagent) to smooth the uneven contours of the wafer surface. [0003] FIG. 1 is a schematic side view of a known chemical mechanical polishing device; FIG. 2 is a schematic top view of a known chemical mechanical polishing device. [0004] Please refer to Figure 1 and Figure 2 at the same time. A known chemical mechanical polishing device includes: a polishing table 100 (Polishing Table), a wafer carrier 106 , a polishing pad (Polishing Pad) 102 , a tube 110 (Tube) and a polishing pad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23Q3/06B24B53/12B24B37/04B24B37/27
Inventor 洪永泰黄启东
Owner MACRONIX INT CO LTD
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