Method of forming sub-micron-size structures over a substrate
A sub-micron and substrate technology, applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of lack of nucleation position arrangement and arrangement ability
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[0023] A method for forming submicron sized structures on a substrate is provided. A width-defining step is formed on the substrate. A width-defining layer is formed on an edge of the width-defining step. The width-defining layer is etched back to leave a spacer adjacent to the width-defining step. A length-defining step is formed on the substrate. A length-defining layer is formed on the edge of the length-defining step. The length-defining layer is etched back to leave a spacer proximate to the first edge of the length-defining step and spanning a first portion of the spacer left by the width-defining layer. Then remove the length-defining step. The spacers left by the width-defining layer are then etched using the spacers left by the length-defining layer as a mask to form the structure.
[0024] Figure 1 illustrates an initial process for forming a structure according to an embodiment of the invention. A substrate 10 is provided, and an insulating layer 12 is formed ...
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