Extrusion-prevention clamp used for solar battery cell edge etching

Abstract

The invention discloses an extrusion-prevention clamp used for solar battery cell edge etching. The extrusion-prevention clamp comprises a substrate, a clamping device and a fixing device, wherein theclamping device and the fixing device are arranged on the substrate respectively; the clamping device comprises a clamping plate, a base plate and a button switch, the clamping plate is fixed on thesubstrate, a mounting groove and a switch groove are formed in the side wall of one side of the clamping plate, an electric push rod I is fixed inside the mounting groove, the button switch is movablyarranged inside the switch groove in an inserted manner, and the button switch is fixed on a spring; and the fixing device comprises a movable plate, a protective cover and a vacuum sucker, and an electric push rod II and the vacuum sucker are electrically connected onto a control panel respectively. According to the extrusion-prevention clamp, battery cells incapable of being stacked and clampeddirectly can be fixed and clamped, so that edge etching is carried out reasonably and effectively under the premise of without mincing the battery cells or damaging PN junctions on the surfaces of the battery cells, the work efficiency is greatly improved, and a great deal of economic loss is also avoided.

Description

technical field [0001] The invention relates to the technical field of solar cells, in particular to an anti-extrusion jig for etching the edge of a single solar cell. Background technique [0002] The steps in the solar cell manufacturing process are as follows: 1. Texturing, corroding the surface of the silicon wafer into a pyramid-like shape; 2. Diffusion, forming a PN junction on the surface of the silicon wafer; 3. Etching, removing the PN junction on the edge of the silicon wafer , to prevent battery short circuit; 4. Remove PSG, clean the surface of the silicon wafer, and remove the silicon dioxide layer; 5. PECVD, coat a layer of anti-reflection film on the surface of the silicon wafer; 6. Printing and sintering, printing electrodes and back field, and drying sintering. [0003] In the face of the global energy crisis, solar photovoltaic power generation technology has become a new development hotspot in the semiconductor industry. The manufacturing of crystalline s...

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Problems solved by technology

[0006] However, the above-mentioned application documents still have obvious defects when performing edge etching: 1. Although the force of the cells can be made more uniform when the cells are sandwiched, there will still be a small part of the cells in a batch of cells. It is smooth and cannot be stacked and clamped well with the rest of the cells, and it is prone to slipping. At this time, this part of the cells needs to be selected and the edges are etched separately. However, because the surface is smoother, the force provided by the fixture must be greater. It is more likely to cause damage to the cells and cause economic losses; 2. Using a jig to stack and clamp the cells will definitely cause wear to the PN junction on the upper surface of the cells, thereby affecting the photoelectric conversion efficiency of the cells and causing unnecessary losses

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