Circuit board and manufacturing method thereof

Abstract

A circuit board comprises an inner-layer circuit substrate, an electronic element, a heat storage assembly, a first outer-layer circuit substrate and a second outer-layer circuit substrate. The inner-layer circuit substrate comprises a first inner-layer circuit layer, an inner-layer dielectric layer and a second inner-layer circuit layer which are stacked, and further comprises a first heat conductor which penetrates through the inner-layer dielectric layer and is connected with the first inner-layer circuit layer and the second inner-layer circuit layer; the electronic element is located on the surface of the inner layer circuit substrate and is connected with the first inner layer circuit layer; the heat storage assembly is located on the surface, away from the electronic element, of the inner-layer circuit substrate and connected with the second inner-layer circuit layer. The first outer-layer circuit substrate is positioned on the surface of the inner-layer circuit substrate, which is provided with the electronic element, and covers the electronic element; the second outer-layer circuit substrate is located on the surface, provided with the heat storage assembly, of the inner-layer circuit substrate and covers the heat storage assembly. The invention further provides a manufacturing method of the circuit board. The circuit board with the heat storage assembly has the functions of storing heat and delaying heat release, and concentrated heat release of the circuit board is avoided.

Description

technical field [0001] The present application relates to the technical field of circuit boards, and in particular, to a circuit board and a manufacturing method of the circuit board. Background technique [0002] Due to the continuous improvement of demand for electronic products, the integration of electronic components on the circuit board has been improved to meet the needs of high-frequency and high-speed operation. A lot of heat is generated during operation. [0003] In the existing heat dissipation technology, a heat dissipation component connected to the casing is usually arranged on the electronic product to transfer heat to the casing and dissipate into the air; or a copper block is embedded in the circuit board to increase the heat dissipation channel to achieve rapid heat dissipation. However, the heat is concentrated on the casing, resulting in excessively high casing temperature and poor user experience (such as discomfort when holding electronic products); b...

AI Technical Summary

Problems solved by technology

However, the concentrated heat is transferred to the casing, resulting in excessive temperature of the casing and poor user experience (such as discomfort when holding electronic products); embedded copper blocks increase the weight of the circuit board, which does not meet the thinning and lightweighting of electronic products characteristics

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