Wafer alignment device and alignment method

Abstract

The invention relates to the technical field of semiconductor processing, in particular to a wafer alignment device and an alignment method. The device comprises a base, a lower movement table and an upper movement table are arranged above the base, calibration marks are arranged on the base, an upper bearing table is arranged on the upper movement table, and a lower bearing table is arranged on the lower movement table; and two sets of visual systems are respectively arranged above the upper bearing platform and below the lower bearing platform. According to the wafer alignment device, a C-shaped arm visual system is omitted, the independent visual system is used for achieving the measurement function, the visual system is not provided with a cantilever structure, and the movement amount of a microscopic part can be directly measured. Before the upper wafer and the lower wafer are finally attached, the relative position change of the upper wafer and the lower wafer can be measured all the time for final compensation.

Description

technical field [0001] The present invention relates to the technical field of semiconductor processing, in particular to a wafer alignment device and an alignment method. Background technique [0002] With the development of science and technology, image processing hardware technology has made rapid progress, and the application of image recognition technology has become more and more extensive. By collecting the data information and analyzing it to obtain key information, so as to meet the development needs of various industries. In the semiconductor industry, image recognition and processing techniques are often combined with microscopic imaging to inspect the quality of microscopic patterns on wafer surfaces, or to measure wafer position. [0003] Bonding is a process in which multiple chips are stacked together, and vertical vias are used to achieve electrical connection between the chips. It has been widely regarded as a way to go beyond "Moore's Law". 3D interconnec...

AI Technical Summary

Problems solved by technology

The position of the air bearing base can be measured by the grating ruler in the X and Y direction moving components. Theoretically, the position of the objective lens at the end of the C-arm is also known. When the air bearing base remains stationary, the C-arm is theoretically stationary and the vision The system also keeps still during image acquisition, so the measured position difference between the upper and lower wafer marks is the position difference between the upper and lower wafers, but due to the complex structure, it is relatively difficult to debug

Images