Flexible circuit board, manufacturing method thereof, display screen and electronic equipment

A technology for flexible circuit boards and manufacturing methods, which is applied in the directions of printed circuit components, electrical connection printed components, and electrical connection formation of printed components, which can solve the problems of reducing the thickness of flexible circuit boards and achieve the effect of reducing thickness

Pending Publication Date: 2022-07-05
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the problem of reducing the thickness of the flexible circuit board, the invention provides a flexible circuit board and its manufacturing method, display screen and electronic equipment

Method used

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  • Flexible circuit board, manufacturing method thereof, display screen and electronic equipment
  • Flexible circuit board, manufacturing method thereof, display screen and electronic equipment
  • Flexible circuit board, manufacturing method thereof, display screen and electronic equipment

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Embodiment Construction

[0039] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0040] see figure 1 and figure 2 , the first embodiment of the present invention provides a flexible circuit board 1, including a main board 11 and a bridge board 12; the main board 11 includes a base material layer 112 and a first conductive layer 111 disposed on one side of the base material layer 112. The first conductive layer 111 is provided with a first insulating layer 114 on the side away from the base material layer 112; the bridge plate 12 includes a second conductive layer 121 located on the side of the first insulating layer 114 away from the first conductive laye...

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Abstract

The invention relates to the technical field of display screens, in particular to a flexible circuit board, a manufacturing method of the flexible circuit board, a display screen and electronic equipment. The main board comprises a base material layer and a first conductive layer arranged on one side of the base material layer, and a first insulating layer is arranged on the face, away from the base material layer, of the first conductive layer. The bridging plate comprises a second conductive layer; the blind hole is formed between the first conductive layer and the second conductive layer, the conductive element is arranged on the side wall of the blind hole to achieve electrical connection, and compared with an existing four-conductive-layer design, the flexible circuit board has the advantage that the thickness of the flexible circuit board is greatly reduced. The invention further provides a method for manufacturing the flexible circuit board, a display screen with the flexible circuit board and electronic equipment with the flexible circuit board.

Description

【Technical field】 [0001] The present invention relates to the technical field of display screens, in particular to a flexible circuit board and a manufacturing method thereof, a display screen and an electronic device. 【Background technique】 [0002] AMOLED (Active-matrix organic light-emitting diode, active matrix organic light-emitting diode or active matrix organic light-emitting diode), is a display technology, mainly used in smartphones, and used in AMOLED FMLOC products The flexible printed circuit (FPC) has interference phenomenon caused by the intersection of the touch signal line and the MIPI signal line, which leads to the appearance of random touch points on the product. At present, in order to avoid the interference caused by the intersection of the Touch signal line and the MIPI signal line on the flexible circuit board, some products of AMOLED products adopt the design of 4-layer copper foil layer, so that the MIPI signal and the Touch signal are completely sep...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/02H05K3/40G09F9/33
CPCH05K1/118H05K1/115H05K1/0228H05K1/0224H05K3/4038G09F9/33
Inventor 兰传艳向勇张千胡潇然
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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