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Mask, display panel manufacturing method and display panel

A display panel and mask technology, which is applied in semiconductor/solid-state device manufacturing, vacuum evaporation plating, coating, etc., can solve the problems of process redundancy and material waste, reduce production processes, improve boundary accuracy, reduce The effect of material cost

Pending Publication Date: 2022-06-03
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are problems such as process redundancy and waste of materials in the production process of the existing display panel with touch function.

Method used

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  • Mask, display panel manufacturing method and display panel
  • Mask, display panel manufacturing method and display panel
  • Mask, display panel manufacturing method and display panel

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Embodiment Construction

[0036] In order to make the purposes, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of the present application, but not all of the embodiments. The components of the embodiments of the present application generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

[0037] Thus, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application as claimed, but is merely representative of selected embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by ...

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Abstract

The embodiment of the invention provides a mask plate, a display panel manufacturing method and a display panel, the mask plate is used for manufacturing a thin film packaging layer of a display module, and the mask plate comprises a mask plate main body, at least one first opening area arranged on the mask plate main body and at least one second opening area arranged on the mask plate main body. The first opening area corresponds to a display area of the display module, and the second opening area corresponds to a bonding area of the display module. Thus, when the thin film packaging layer of the display module is formed, the mask with the first opening area and the second opening area is used, the thin film packaging layer can be formed in the display area, and meanwhile the protection layer can be formed in the bonding area. When the touch module is manufactured, a touch buffer layer does not need to be formed, and the bonding area is protected from being etched through the protective layer. Therefore, on one hand, the manufacturing procedures can be reduced, the material cost can be reduced, on the other hand, the weight of the mask can be reduced, and the boundary precision of the thin film packaging layer in the evaporation process can be improved.

Description

technical field [0001] The present application relates to the field of display device manufacturing, and in particular, to a mask, a method for manufacturing a display panel, and a display panel. Background technique [0002] A display panel with touch function usually includes a display module and a touch module. In the manufacturing process of such a display panel, a display module having a display area and a bonding area is usually fabricated first, and the bonding area is used for connection with other circuits of the electronic device. Next, a thin-film encapsulation (TFE) layer is formed on the display area of ​​the display module, and then a touch module is fabricated on the thin-film encapsulation layer. The touch module includes at least two metal layers and an insulating layer between the metal layers. Since the metal layer needs to be patterned by an etching process, before fabricating the metal layer of the touch module, it is usually necessary to fabricate a t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04C23C14/24C23F1/02H01L51/56H01L27/32H01L51/52
CPCC23C14/042C23C14/24C23F1/02H10K59/40H10K59/12H10K50/844H10K71/00
Inventor 赵栋赵晶晶许亚军李金库刘明星王腾雨李妍妍
Owner YUNGU GUAN TECH CO LTD
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