Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor element overturning equipment

A technology of flipping equipment and semiconductors, applied in conveyor objects, sustainable manufacturing/processing, climate sustainability, etc., can solve the problem that the cleanliness level does not meet higher requirements, the accuracy of the construction period cannot be guaranteed, and the processing and transportation cycle can be extended. problems, to achieve the effect of saving labor costs, ensuring stability, and smooth transfer process

Pending Publication Date: 2022-05-17
SHANGHAI TECHSENSE CO LTD
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing semiconductor component transfer equipment cannot be modularized to meet the needs of different production processes, nor can the workshop fully automate the operation of the product line, and the cleanliness level does not meet higher requirements, which affects the production and processing of products and prolongs processing Due to the transportation cycle, the accuracy of the construction period cannot be guaranteed, so a semiconductor element flipping device is designed for this

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor element overturning equipment
  • Semiconductor element overturning equipment
  • Semiconductor element overturning equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, and the present invention will be further elaborated.

[0042] First, combine the Figure 1~6 The semiconductor component flipping device according to the embodiment of the present invention is described, which is used to transfer semiconductor components (such as wafers, PCB boards, etc.) and flip the transferred workpieces, and has a wide range of application scenarios.

[0043] like Figure 1~6 As shown, the semiconductor element flipping device according to the embodiment of the present invention has a frame body 1 , a loading and unloading module, a jacking module and a flipping module.

[0044] Specifically, such as Figure 1~2 As shown, in this embodiment, the loading and unloading module is connected with the frame body 1 for loading and unloading external workpieces, the jacking module is connected with the loading and unloading ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses semiconductor element overturning equipment, which comprises a frame body; the loading and unloading module is connected with the frame body and is used for loading and unloading external workpieces; the material jacking module is connected with the feeding and discharging module and used for jacking the workpieces; and the overturning module is connected with the frame body and is used for overturning the workpiece. Different position distribution can be carried out according to the production requirements of subsequent procedures, modular transfer and transfer are achieved, intelligent workpiece machining and conveying are achieved, manual operation is not needed, the transfer process is smooth, the speed is high, efficiency is high, the stability of the machining period can be guaranteed, the labor cost is saved, and the production efficiency is improved. Workpieces can be turned over during transfer conveying, and the problem that special workpieces need to be turned over is solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor element production, processing and transfer equipment, in particular to a semiconductor element flipping equipment. Background technique [0002] The existing semiconductor component transfer equipment cannot be modularized to meet the needs of different production processes, nor can the workshop fully automate the operation of the product line, and the cleanliness level does not meet higher requirements, which affects the production and processing of products and prolongs processing Due to the transportation cycle, the accuracy of the construction period cannot be guaranteed, so a semiconductor element flipping device is designed for this. Contents of the invention [0003] According to an embodiment of the present invention, a semiconductor element flipping device is provided, including: [0004] frame; [0005] The loading and unloading module is connected to the frame body and is u...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/248B65G15/22B65G47/88
CPCB65G47/248B65G15/22B65G47/8807Y02P70/50
Inventor 林海涛赵凯梁猛郑建峰张恒涛
Owner SHANGHAI TECHSENSE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com