Random multi-area efficient polishing path planning method oriented to matching working conditions
A path planning, multi-area technology, applied in program control, instrumentation, electrical program control, etc., can solve problems such as unconsidered, unsuitable idle travel length, and inability to apply multi-area
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[0063] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.
[0064] Such as figure 1 As shown, the embodiment of the present invention provides a random multi-region high-efficiency grinding path planning method for cooperative working conditions. Taking the IRB6700 robot as an example, the main steps are as follows:
[0065] (1) It is necessary to measure before starting to plan the path. The point cloud data of the matching surface of the soft and hard...
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