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Random multi-area efficient polishing path planning method oriented to matching working conditions

A path planning, multi-area technology, applied in program control, instrumentation, electrical program control, etc., can solve problems such as unconsidered, unsuitable idle travel length, and inability to apply multi-area

Pending Publication Date: 2022-05-13
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the method in the patent document CN112947309A is only aimed at a single area to be processed, and does not take into account the processing order and connection transition of multiple areas when there are multiple areas, and cannot be applied to the situation of multiple areas.
Both the task path planning methods disclosed in the patent document CN107932505A and the patent document CN111203788A have the problem that the area to be processed is abstracted into a point instead of a real area. The methods proposed in the literature are difficult to apply when the impact is large

Method used

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  • Random multi-area efficient polishing path planning method oriented to matching working conditions
  • Random multi-area efficient polishing path planning method oriented to matching working conditions
  • Random multi-area efficient polishing path planning method oriented to matching working conditions

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Embodiment Construction

[0063] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0064] Such as figure 1 As shown, the embodiment of the present invention provides a random multi-region high-efficiency grinding path planning method for cooperative working conditions. Taking the IRB6700 robot as an example, the main steps are as follows:

[0065] (1) It is necessary to measure before starting to plan the path. The point cloud data of the matching surface of the soft and hard...

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Abstract

The invention discloses a random multi-region efficient polishing path planning method oriented to a matching working condition, which comprises the following steps: S100, measuring to obtain point cloud data of a matching surface of a soft mold and a hard mold, performing principal component analysis on the point cloud data to correct, fitting the surface of the point cloud data of a stiffened wall plate, taking a complementary set, matching with the point cloud data of a sacrificial layer, and obtaining the point cloud data of the stiffened wall plate; taking a difference value in the height direction to obtain a to-be-processed height map of the surface of the sacrificial layer; s200, the maximum height and the minimum height of the height map to be machined are extracted, and the machining sequence and the single-time machining depth are planned according to the maximum height difference, the grinding head removal depth model and the workpiece surface matching precision requirement; s300, the processing sequence and the polishing path of each area are optimized at the same time through an immune genetic algorithm; and S400, the grinding path and the transition path are dispersed according to the maximum step length requirement, a series of cutter contact points are obtained, the cutter axis vector and cutter location point data are calculated according to the feeding direction and the surface normal vector, and therefore a cutter location trajectory planning path is obtained.

Description

technical field [0001] The invention belongs to the field of advanced manufacturing technology, and more specifically relates to a random multi-region high-efficiency grinding path planning method under cooperative working conditions. Background technique [0002] In the traditional large-scale composite material reinforced wall panel rib / skin integrated molding and manufacturing process, in order to meet the precision of the surface matching, the technology of matching hard film and soft film (mostly rubber material) molds is often used. Among them, the precise processing of soft molds is a major difficulty. At present, the commonly used method is manual measurement and grinding. First, smear red powder on the surface of the hard mold, and stick it with a soft mold, mark the area to be processed, and perform grinding and polishing. Repeat this process of inspection and processing until the two surfaces are accurately bonded. Due to the need for multiple grinding and polis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/19
CPCG05B19/19G05B2219/34093Y02P90/30
Inventor 张小俭吴毅陈巍严思杰丁汉
Owner HUAZHONG UNIV OF SCI & TECH
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