Magnetic field induced arrangement carbon fiber heat conduction material and preparation method thereof

Abstract

The invention discloses a magnetic field induced arrangement carbon fiber heat conduction material and a preparation method thereof, and relates to the technical field of heat management. The magnetic field induced arrangement carbon fiber heat conduction material comprises, by mass, 5-80% of carbon fibers, 10-85% of a polymer matrix, 5-15% of a curing agent, 5-15% of a film forming agent and 0.1-1% of a catalyst. The method comprises the following steps: adding 5-80% of carbon fibers into a polymer matrix, and carrying out mechanical stirring and ultrasonic dispersion to obtain a dispersion; adding a film-forming agent and a catalyst into the dispersion, and then carrying out mechanical stirring for less than or equal to 1 min to obtain a mixture; transferring the mixture into a glass or other non-magnetic container; the container and the mixture are transferred into a magnetic field, one surface of the container is perpendicular to the magnetic induction intensity direction, the mixture is changed into a solid state from a liquid state, and the mixture is moved out of the magnetic field; and transferring the solid mixture to an electrothermal constant-temperature blast drying box, and further heating and curing to obtain the directionally-arranged carbon fiber heat-conducting material.

Description

technical field [0001] The invention relates to the technical field of heat management, in particular to a magnetic field induced arrangement carbon fiber heat conduction material and a preparation method thereof. Background technique [0002] With the gradual increase in the density of electronic devices, the issue of heat conduction has become a topic of concern in the field of materials and electronics industries. Thermal interface materials connect devices and heat sinks and become the key to heat conduction of devices. At present, the main thermal interface materials used are thermal conductive silicone grease, thermal pads, etc. Most of them use metal nitrides, metal oxides, etc. Material. In addition, with the rapid development of lightweight, polymers have replaced traditional metal materials in many occasions. However, polymers have low thermal conductivity, which affects their applications. It is urgent to solve the problem of low thermal conductivity. [0003] M...

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Problems solved by technology

However, the axial thermal conductivity of carbon fiber is higher and the radial thermal conductivity is lower

Generally, the arrangement of carbon fibers in carbon fiber composite materials is disorderly, and the excellent performance of high axial thermal conductivity of carbon fibers cannot be fully utilized. The thermal conductivity of carbon fiber composite materials is only 1~5W / (m·K)

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