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Isolation type LED packaging structure

An LED packaging and isolation technology, applied in lighting devices, gas/waterproof devices, components of lighting devices, etc., can solve the problems of inability to electrostatically insulate, inconvenient to disassemble, and easy to enter into the interior of the shell, etc. Good isolation and sealing effect, good insulation effect, convenient installation effect

Pending Publication Date: 2022-05-06
深圳市伟方成科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing LED package structure has complex and cumbersome operation steps during production and installation, and it is inconvenient to disassemble the packaged LED, thus causing great difficulties in the maintenance and replacement of the LED light source in the later stage, and the existing The LED packaging structure does not have a good isolation and sealing function. External dust and water vapor can easily enter the interior of the housing, which will affect the stability and service life of the LED light source. At the same time, it cannot insulate static electricity, and the LED light source is affected by static electricity. also affect the service life

Method used

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Embodiment Construction

[0026] see Figure 1-7 , in an embodiment of the present invention, an isolated LED packaging structure includes an isolation base plate 1, an LED board chute 2 is opened on the upper side of the isolation base plate 1, and an LED board body 3 is slidably connected to the inner side of the LED board chute 2, and the LED The lower side of the board body 3 is connected with five buffer springs 5 ​​at equal intervals, and one end of the five buffer springs 5 ​​is connected to the bottom end of the LED board chute 2, and an upper case 4 is arranged above the isolation base plate 1, and the upper case The inner side surface of 4 is located at the lower side edge and is provided with a case slot 8, and the inner upper end of the upper case 4 is fixed with eight compression isolation plates 6 at equal intervals, and the two sides of the isolation bottom plate 1 correspond to the case slot 8. There are ten engaging inserting rods 7 inserted symmetrically at the position, and the ten e...

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Abstract

The invention relates to the technical field of LED packaging, in particular to an isolation type LED packaging structure, an LED plate sliding groove is formed in the upper side of an isolation bottom plate, an LED plate body is slidably connected to the inner side of the LED plate sliding groove, five buffer springs are connected to the lower side of the LED plate body at equal intervals, one end of each buffer spring is connected with the bottom end of the LED plate sliding groove, and the other end of each buffer spring is connected with the bottom end of the isolation bottom plate. An upper cover shell is arranged above the isolation bottom plate, a cover shell clamping groove is formed in the position, located on the lower side edge, of the inner side surface of the upper cover shell, and eight pressing isolation plates are fixed to the upper end of the inner side of the upper cover shell at equal intervals. According to the LED panel, the clamping mechanism is packaged to drive the clamping insertion rod to move, so that the clamping insertion rod is combined with and separated from the cover shell clamping groove, the isolation bottom plate and the upper cover shell can be clamped, fixed and separated simply and quickly, installation during production is facilitated, and meanwhile, the LED panel body is convenient to detach to be maintained and replaced.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an isolated LED packaging structure. Background technique [0002] LED light source is a green and environmentally friendly new light source. It has been widely used in the field of lighting. At present, there are many kinds of LED packaging structures on the market. The current packaging forms of LED light sources mainly include: one is to install LED chips on transparent substrates The second is to mount the LED chip on a transparent substrate, and then encapsulate it in a transparent device coated with a phosphor layer. [0003] However, the existing LED package structure has complex and cumbersome operation steps during production and installation, and it is inconvenient to disassemble the packaged LED, thus causing great difficulties in the maintenance and replacement of the LED light source in the later stage, and the existing The LED packaging structure does not hav...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V15/01F21V15/04F21V31/00F21V15/00F21V19/00H01L25/075H01L33/48F21Y115/10
CPCF21V15/01F21V15/04F21V31/005F21V15/00F21V19/003H01L25/0753H01L33/483F21Y2115/10
Inventor 王伟吴国庆尹建平
Owner 深圳市伟方成科技有限公司
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