Novel gold wire bonding equipment for integrated circuit chip

Abstract

The invention discloses novel gold wire bonding equipment for an integrated circuit chip, which belongs to the technical field of electronic equipment and can play a role in clamping a chip product through the cooperation of a limiting plate and a top plate, so that the chip products of different types can be fixed, and the chip products can be prevented from being damaged. The chip product can be prevented from deviating and shaking due to mechanical vibration, as the service time is prolonged, when a limiting plate deviates due to mechanical vibration, a push plate is driven by the restoring force of a spring so that the push plate can continue to clamp the chip product, and through matched arrangement of an expansion top ball and a clamping tooth ring plate, the chip product can be clamped more stably. In addition, when the bolt is loosened due to mechanical vibration, the restoring force of the spring can be utilized to pull the trigger plate and trigger the alarm of the buzzer, so that a worker is prompted to take corresponding treatment, and the bonding stability of the chip product is improved.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, and more specifically, relates to a novel integrated circuit chip gold wire bonding equipment. Background technique [0002] The chip is a precision device, and its strength is relatively fragile and fragile. Since the chip is subjected to mechanical vibration and pressure during the bonding process, if it is not fixed, the chip will move irregularly or even jump during the bonding process. [0003] However, the automatic gold wire bonding equipment comes with a fixed seat that is suitable for very few types of products, and cannot be used for bonding all existing products of the company. There are many types of products in the company. If each type of chip product is equipped with a bonding equipment, the Too large; even if each type of chip is processed with one tooling, the investment is very large. [0004] However, according to the requirements of the company's chip products, e...

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Problems solved by technology

[0003]However, the automatic gold wire bonding equipment comes with a fixed seat suitable for very few types of products, which cannot be suitable for bonding all the company's existing products, and the existing company has a wide range of products , if each type of chip product is equipped with a bonding equipment, the consumption is too large; even if each type of chip is processed with a tooling, the investment is also large

[0004]However, according to the requirements of the company's chip products, each fully automatic gold wire bonding equipment should be suitable for all chip products. Currently, the existing equipment on the market cannot meet the needs of the company. Therefore, according to the actual production requirements, under the conditions of convenient operation, low price and high pass rate, this tooling was designed and developed.

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