Cleaning tool and cleaning method for semiconductor wafer

Abstract

The invention provides a cleaning tool and a cleaning method for a semiconductor wafer. The cleaning tool for the semiconductor wafer comprises a first clamping plate and a second clamping plate, a plurality of first through holes are formed in the first clamping plate, and a sinking groove is formed in one side of each first through hole; the sinking groove is formed in the first surface of the first clamping plate, the opening end of the sinking groove is formed in the hole wall of the first through hole, and the sinking groove and the first through hole form a communicating structure; a plurality of second through holes are formed in the second clamping plate, a protrusion is arranged on one side of each second through hole, and the protrusions are arranged on the first surface of the second clamping plate; the multiple first through holes are opposite to the multiple second through holes in a one-to-one mode, one end of the protrusion is located in the sinking groove, and a containing space is defined in the communicating structure based on the end face of the protrusion and the groove bottom of the sinking groove. According to the semiconductor wafer cleaning device, the semiconductor wafers can be conveniently separated and stored, the semiconductor wafers are prevented from being stacked in the cleaning process, the semiconductor wafers can be fully cleaned, the semiconductor wafers are prevented from being broken, damaged or stacked in the cleaning process, and therefore the good cleaning effect is achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor wafer cleaning tool and cleaning method. Background technique [0002] At present, when cleaning small-sized semiconductor wafers, a large number of semiconductor wafers are first put into a mesh cleaning basket, and then cleaned by an automatic cleaning machine. After the cleaning process is completed, the semiconductor wafers are introduced into the crucible for alcohol dehydration , and finally, the semiconductor wafer is dried on the electric heating plate. [0003] In actual operation, the above-mentioned cleaning method mainly has various defects or deficiencies, which are mainly reflected in the following two aspects: first, semiconductor wafers are easy to be stacked in the cleaning basket, and the overlapping parts between semiconductor wafers have insufficient cleaning and cleaning effect The poor problem caused most of the semiconductor wafers t...

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a cleaning tool and cleaning method for semiconductor wafers, which are used to solve or improve at least one technical problem existing in the prior art, so as to improve cleaning operation efficiency, ensure cleaning effect, and prevent semiconductor wafers from collapsing during cleaning. , broken or laminated

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