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Method and mold for preparing heat-conducting gasket and obtained heat-conducting gasket

A technology of thermally conductive gaskets and molds, which is applied to household appliances, other household appliances, household components, etc., can solve the problems of complexity, efficiency and cost that do not meet production needs, and consume large amounts of energy. The method is simple, the orientation is improved, and the The effect of reducing the number of processing steps

Active Publication Date: 2022-04-19
宁波材料所杭州湾研究院 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, methods such as electromagnetic fields and ice templates are relatively complicated, and require a large amount of energy to generate strong electromagnetic fields or perform continuous freezing, and the efficiency and cost are not suitable for production needs.

Method used

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  • Method and mold for preparing heat-conducting gasket and obtained heat-conducting gasket
  • Method and mold for preparing heat-conducting gasket and obtained heat-conducting gasket
  • Method and mold for preparing heat-conducting gasket and obtained heat-conducting gasket

Examples

Experimental program
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Effect test

preparation example Construction

[0081] In order to use the mold to prepare a thermal pad, the application provides a method for using a similar mold, including the following steps:

[0082] (1) Install the polymer storage bin 7, the metal partition plate 3, the metal mesh sheet 4 and the heat-conducting filler forming bin 6 in sequence, and fix the four together with fastening screws 5;

[0083] (2) Add the thermally conductive filler powder into the thermally conductive filler forming chamber 1 and shake it tightly, insert the metal pressing sheet into the groove a1 and press it tightly;

[0084] (3) Pour the liquid resin matrix precursor (ie high molecular polymer) into the groove b2.

[0085] (4) Put the mold into the vacuum chamber, use a vacuum pump to extract the air between the fillers, and the liquid resin matrix (ie polymer) will fill the vacuum between the thermally conductive fillers to form a thermal pad precursor.

[0086] (5) Put the mold in step 4 into a heating oven to cure the resin.

[00...

Embodiment 1

[0089] Raw materials: 2 g of silicone oil, 2 g of hydrogenated silicone oil, 0.05 g of platinum catalyst, and 2 g of carbon fiber (particle size: 250 μm).

[0090] first as figure 1 Mount the mold as shown, pass the carbon fiber 2g through figure 2 The hatch of the shown thermally conductive filler layer forming bin 6 is filled. When filling, the vibration and compaction operations should be carried out at the same time, so that the carbon fiber heat-conducting filler added to each layer can be oriented and compacted in time. Then insert the metal press and compact. Then mix 2g of silicone oil, 2g of hydrogenated silicone oil, and 0.05g of platinum catalyst (silicone oil and hydrogenated silicone oil generate silicone rubber under the action of the catalyst), stir evenly, and pass through the figure 2 The hatch of the shown high molecular polymer storage bin 7 is filled. After filling, put the whole mold into the vacuum equipment, and use the vacuum pump to exhaust. At t...

Embodiment 2

[0092] Raw materials: 5 g of silicone oil, 5 g of hydrogenated silicone oil, 0.5 g of platinum catalyst, and 5 g of boron nitride (with a particle size of 10 μm). Ethyl acetate 1.5g.

[0093] first as figure 1 Install the mold and pass 5g of boron nitride through figure 2 The hatch of the shown thermally conductive filler layer forming bin 6 is filled. When filling, the operation of shaking and compacting should be carried out at the same time, so that the boron nitride thermal conductivity filler added in each layer can be oriented and compacted in time. Then insert the metal press and compact. Since boron nitride is a two-dimensional material, the filling is denser and the contact area is larger, and it is difficult for polymers to enter, so ethyl acetate needs to be added to dilute the resin. Then mix 5g of silicone oil, 5g of hydrogenated silicone oil, 0.5g of platinum catalyst, and 1.5g of ethyl acetate, stir evenly, and pass through the figure 2 The shown high mol...

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Abstract

The invention discloses a method and a mold for preparing a heat-conducting gasket and the obtained heat-conducting gasket. The heat-conducting gasket comprises a heat-conducting filler layer, the heat-conducting filler layer comprises granular heat-conducting filler; the adjacent heat-conducting fillers are in direct contact to form a continuous three-dimensional heat-conducting network containing internal gaps; internal gaps of the three-dimensional heat conduction network are filled with a high-molecular polymer. The heat-conducting gasket is obtained by prefabricating the three-dimensional heat-conducting network of the heat-conducting filler, simultaneously completing orientation of the anisotropic heat-conducting filler and then filling the prefabricated three-dimensional heat-conducting network with the glue, so that direct contact between the fillers is ensured, formation of a heat-conducting three-dimensional heat-conducting passage is ensured, and the heat conductivity coefficient of the heat-conducting gasket is effectively improved. The method is simple, low in cost and good in universality.

Description

technical field [0001] The application relates to a method for preparing a heat conduction gasket, a mold and the obtained heat conduction gasket, which belong to the field of heat conduction materials for electronic devices. Background technique [0002] With the increasing integration of microelectronic devices, the problem of waste heat has become a key issue restricting the development of the industry. The waste heat of electronic devices causes the temperature of the device to rise, which will reduce the stability of the system, affect the performance of the device, and shorten the service life of the device. As a device used to improve the thermal conductivity between the heat source and the cold source, the thermal pad is widely used in the field of electronics and electrical engineering to solve the problem of waste heat of electronic devices. [0003] In the application, the thermal conductivity of the thermal conductivity sheet is generally improved by blending hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/05C08K7/06C08K3/38C08K3/04C08K3/22C08K13/02B29C70/88
CPCC08L83/04B29C70/88B29L2031/3406C08L2203/20C08L2205/025C08K2201/005C08K2003/385C08K7/06C08K3/38C08K3/04C08K3/22C08K13/02Y02E60/10
Inventor 虞锦洪李茂华代文褚伍波林正得江南
Owner 宁波材料所杭州湾研究院
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