A kind of lithium tantalate crystal head and tail cutting method

Abstract

The present invention relates to the technical field of piezoelectric crystals, in particular to a head-to-tail cutting method for lithium tantalate crystals, comprising the following steps: a) sandblasting and roughening the side surfaces of lithium tantalate crystals; Fix it, use the orientation instrument to orient the crystal, and adjust the crystal position through the screws on the side of the fixture to determine the crystal orientation; c) Install the oriented fixture on the head of the inner circle cutting machine, and adjust the inner circle cutting machine through the level Head inclination, make the bottom surface of the jig in a horizontal state, and cut the end face of the crystal head; d) After cutting the end face of the crystal head, remove the crystal from the jig, invert the crystal and fix it again, and adjust the inclination angle of the head of the inner circular machine through a level to make the crystal The end face of the head reaches a horizontal state, and the end face of the crystal tail is cut. The finally obtained crystal has no end face marks, poor breakage, no cracks, and poor edge chipping, and the crystal orientation deviation is within 6'.

Description

technical field [0001] The invention relates to the field of piezoelectric crystals, in particular to a method for cutting the head and tail of a lithium tantalate crystal. Background technique [0002] In recent years, due to the widespread use of high-frequency and multi-band communications in wireless communications represented by mobile phones, the demand for surface acoustic wave filters (SAWs) has increased significantly, and the quality requirements are also higher. With the continuous development of surface acoustic wave technology, the application field of surface acoustic wave devices continues to expand, and can be used in mobile phones, multimedia data broadcasting systems (such as VOD, etc.), automotive electronics, wireless LAN and digital TV. Market demand. At the same time, the miniaturization of communication equipment requires more precise production of each component, so that the SAW also tends to be miniaturized. [0003] With the increasing demand for ...

AI Technical Summary

Problems solved by technology

This method needs to find the X, Y, and Z-axis crystal orientations, calculate the displacement through laser reflection, and adjust the crystal deflection. The operation process is complicated, and the fixed glass sheets on the X and Y surfaces are difficult to fix accurately in the actual process, and crystal orientation deviations are prone to occur.

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