Temperature control method and device, electronic equipment and computer storage medium

A temperature control method and temperature parameter technology, applied in the field of temperature control methods, electronic equipment and computer storage media, and devices, can solve problems affecting user experience, etc.

Pending Publication Date: 2022-03-29
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for a certain NTC resistor, the trigger temperature for temperature control that needs to be implemented in order to reduce the heating of the mobile phone may not be set high, so most user scenarios will trigger temperature control, affecting user experience.

Method used

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  • Temperature control method and device, electronic equipment and computer storage medium
  • Temperature control method and device, electronic equipment and computer storage medium
  • Temperature control method and device, electronic equipment and computer storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] figure 1 It is a flow chart of a temperature control method according to an embodiment of the present invention, and reference will be made below figure 1 , a temperature control method according to an embodiment of the present invention is described in detail.

[0033] First, in step 101, a temperature parameter is acquired, and the temperature parameter includes an internal temperature of a terminal device and / or an external ambient temperature.

[0034] In this embodiment, the temperature control method is mainly applied to mobile terminals, such as mobile phones, tablet computers and the like. The internal temperature of the terminal device is the temperature of the preset position inside the terminal device. The temperature of the terminal device is mostly obtained through NTC resistors and / or temperature sensors. There are multiple NTC resistors and temperature sensors, which can be distributed inside the chip. It can also be near the heat source, or it can be p...

Embodiment 2

[0051] figure 2 It is a flow chart based on OR logic operation according to an embodiment of the present invention, and reference will be made below figure 2 , the OR-based logical operation flow of the embodiment of the present invention is described in detail.

[0052] First, in step 201, start.

[0053] In step 202, NTC1>temperature threshold 1.

[0054] In the embodiment of the present invention, it is judged whether the temperature value of NTC1 is greater than the temperature threshold value 1, if yes, output 1; if not, output 0.

[0055] In step 203, NTC2>temperature threshold 2.

[0056] In the embodiment of the present invention, it is judged whether the temperature value of NTC2 is greater than the temperature threshold value 2, if yes, output 1; if not, output 0.

[0057] In step 204, OR operation.

[0058] In the embodiment of the present invention, an OR logic operation is performed according to the judgment results of step 202 and step 203 , and the operat...

Embodiment 3

[0070] image 3 It is a flow chart based on AND logic operation according to an embodiment of the present invention, and reference will be made below image 3 , to describe in detail the AND logic operation flow of the embodiment of the present invention.

[0071] First, in step 301, start.

[0072] In step 302, NTC3>temperature threshold 3.

[0073] In the embodiment of the present invention, it is judged whether the temperature value of NTC3 is greater than the temperature threshold value 3, if yes, output 1; if not, output 0.

[0074] In step 303, NTC4>temperature threshold 4.

[0075] In the embodiment of the present invention, it is judged whether the temperature value of NTC4 is greater than the temperature threshold value 4, if yes, output 1; if not, output 0.

[0076] In step 304, AND operation.

[0077] In the embodiment of the present invention, an AND logic operation is performed according to the judgment results of steps 302 and 303 , and the operation result ...

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Abstract

The invention discloses a temperature control method which comprises the following steps: acquiring temperature parameters which comprise the internal temperature of terminal equipment and / or the external environment temperature; when the temperature parameter exceeds a preset temperature threshold value, performing logic processing on the temperature parameter; and determining whether to trigger temperature control according to a logic processing result. The invention further provides a temperature control device, the technical problem that the technical performance of terminal equipment is reduced for cooling is solved, accurate temperature control implementation is achieved, and temperature control is prevented from being triggered too early or too late; the heating of the mobile phone and the experience of other users using the mobile phone can be balanced, and the technical effect that the user experience of the user in other use scenes is influenced due to reduction of the heating of the mobile phone is avoided.

Description

technical field [0001] The invention relates to the technical field of temperature control, in particular to a temperature control method, device, electronic equipment and computer storage medium. Background technique [0002] With more and more functions of mobile phones, the impact of mobile phone heating on user experience has been paid more and more attention by mobile phone manufacturers. At present, physical heat dissipation materials such as graphite, silica gel pads, and copper tubes are mostly used in the market to achieve heat dissipation. [0003] The use of heat dissipation materials such as graphite, silicone pads, and copper tubes will increase the cost of mobile phones and the internal space. Therefore, on the basis of balancing the cost performance of mobile phones, mobile phone manufacturers will not use many heat dissipation materials, but will use software temperature In some scenarios where the mobile phone generates a lot of heat, the heating temperature...

Claims

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Application Information

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IPC IPC(8): G05D23/20
CPCG05D23/20
Inventor 梁超许冬艳王建成刘文斌
Owner ZTE CORP
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