Method and device for treating drilling residues of printed circuit board

Abstract

The invention discloses a printed circuit board drilling residue treatment method and device, and the method comprises the steps: enabling a printed circuit board to move along a conveying path before the washing process of the printed circuit board, and carrying out the vibration treatment of a to-be-cleaned drilling hole. The device comprises a plate grinding machine platform using a motor to drive a plurality of row rollers, wherein the motor is linked with the row rollers; the device further comprises a supporting steel plate, a vibration part and an ejector rod part. A supporting steel plate is installed on the plate grinding machine platform, the ejector rod part is arranged between the platform and the supporting steel plate, and the supporting steel plate is connected with a vibration part. According to the processing method and device for the drilling residues of the printed circuit board, the drilling residues in the back drilling hole of the printed circuit board can be effectively cleaned, high-pressure, ultrasonic and other washing processing in the subsequent process is facilitated, the quality of the printed circuit board is improved, and the reject ratio is reduced.

Description

technical field [0001] The invention relates to the field of circuit board equipment, in particular to a method and device for processing drilling residues of printed circuit boards. Background technique [0002] With the expansion of 5G communication applications, some related electronic products, such as high-speed servers or supercomputers, use high-speed materials. Such products generally have the characteristics of high stacked layers of circuit boards, large thickness, small drilling, and high wiring density. Due to the particularity of this type of circuit board material, the drilling aperture is extremely small and most of them have a high aspect ratio, friction will generate high temperature during the drilling process, and some resin, copper scrap, glass fiber, etc. will adhere to the hole wall and cause Poor hole plugging, this kind of plugging hole cannot completely remove the adhesive residue after passing through a conventional cleaning machine (or plate grinde...

AI Technical Summary

Problems solved by technology

Due to the particularity of this type of circuit board material, the drilling aperture is extremely small and most of them have a high aspect ratio, friction will generate high temperature during the drilling process, and some resin, copper scrap, glass fiber, etc. will adhere to the hole wall and cause Poor hole plugging, this kind of plugging hole cannot completely remove the adhesive residue after passing through a conventional cleaning machine (or plate grinder), especially when it comes to back-drilling products with high aspect ratios, it is extremely difficult to remove 100% of the residue in the hole, and eventually may Will lead to poor reliability of the product or even scrapped

Images