High-yield SMT process for solder paste printing

Abstract

The invention discloses a high-yield SMT process for solder paste printing, relates to the technical field of SMT, and aims to solve the problems that existing solder paste printing mostly adopts silk-screen printing, the printing precision is low, and printing correction is inconvenient. The solder paste jet printing machine head comprises a first base, a second base and a feeding mechanism, the feeding mechanism is located at the upper end of the second base, the first base is connected with the second base in a welded mode, a material supplementing barrel is installed at the lower end of the first base, a printing spray rod is installed at the lower end of the material supplementing barrel, and the feeding mechanism comprises a material storage barrel and a constant-temperature heating sleeve. The constant-temperature heating sleeve is located on the outer side of the material storage barrel, the material storage barrel is connected with the constant-temperature heating sleeve in a glued mode, a material conveying pipe is installed between the material storage barrel and the material supplementing barrel, the material conveying pipe is fixed to the material storage barrel and the material supplementing barrel in a sealed mode, and negative-pressure dust suction rods are installed on the two sides of the lower end of the first base. A negative pressure dust suction nozzle is arranged at the lower end of the negative pressure dust suction rod, and dust collection boxes are installed on the two sides of the upper end of the first base.

Description

technical field [0001] The invention relates to the technical field of SMT, in particular to a high-yield SMT process of solder paste printing. Background technique [0002] SMT is a surface assembly technology, also known as surface mount technology, which can mount non-pin or short-lead surface mount components on the surface of a printed circuit board or other substrates. It is mainly used in the electronics industry. Before the components are attached to the substrate, it is necessary to print solder paste on the corresponding position of the substrate. After reflow soldering, the solder paste will firmly fix the surface mount components on the substrate and form a path. The quality of solder paste printing is very important. The quality of surface mount products has a greater impact. [0003] However, the existing solder paste printing mostly adopts screen printing, the printing accuracy is low, and printing correction is inconvenient, so it does not meet the existing ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-yield SMT process for solder paste printing, so as to solve the problems that the existing solder paste printing in the above-mentioned background technology mostly uses screen printing, the printing accuracy is low, and printing correction is inconvenient.

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