Processing technology of Skip Via laser drilling

A technology of laser drilling and processing technology, which is applied to the formation of electrical connections of printed components, electrical components, and printed circuit manufacturing. It can solve problems such as residual glue, improve the quality of the hole wall, ensure the quality of the hole wall, and repair the hole wall. Effect

Pending Publication Date: 2022-03-22
江西志浩电子科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] The invention provides a Skip Via laser drilling processing technology. The processing technology adopts the blind hole Comformask window design, firstly etches the copper skin above the blind hole, and then adopts the laser hole expansion data design, through the small mask, small Energy, multiple guns and other methods solve the problem of residual glue at the bottom of this type of Skip Via hole, and the obtained blind hole is of high quality and good reliability

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  • Processing technology of Skip Via laser drilling
  • Processing technology of Skip Via laser drilling
  • Processing technology of Skip Via laser drilling

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Embodiment 1

[0047] A processing technology of Skip Via laser drilling, comprising the following steps:

[0048] S1. First design the position of the blind hole with a laser on the laminated substrate. The window opening data is designed to be 8 mil larger than the D of the laser drilled hole (blind hole), and then open the window on the copper skin at the position where the laser blind hole is drilled. Then the copper skin is etched away by exposure, development and etching, the measured size meets the requirements, and the window opening of the Comfort mask is completed;

[0049] S2. Pre-design the laser reaming data, and form a set of laser drilling data with the same diameter through multiple small holes. The size of Skip Via aperture is divided to determine the number of holes in 30-40 holes, and the laser reaming data is input into the laser drilling machine;

[0050] S3. Set the laser drilling method according to the aperture size, put the substrate after the Comfor mask window is ...

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Abstract

The invention relates to the technical field of circuit board processing, in particular to a Skip Via laser drilling processing technology, which comprises the following steps of: finishing Comfor mask windowing on a laminated substrate; laser reaming data are designed in advance; a laser drilling method is set according to the size of the hole diameter, and a Skip Via hole is obtained; and carrying out copper deposition on the substrate with the Skip Via hole and then entering a subsequent processing flow. According to the processing technology, blind hole Comfor mask windowing is adopted, a copper sheet above a blind hole is etched off firstly, then laser reaming data design is adopted, and the Skip Via hole obtained through methods of small mask, small energy, multiple gun numbers and the like is good in hole pattern and reliable in quality, the problem of adhesive residue at the bottom of the Skip Via hole is solved, and follow-up processing is facilitated.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a Skip Via laser drilling processing technology. Background technique [0002] With the rapid development of 5G communication electronic consumer products, especially the emergence of smart phones and wearable products, PCB, as the main component of electronic products, is also developing in the direction of high-density interconnection. The holes on the PCB are small and three-dimensional, and the hole diameter is getting smaller and smaller, the medium is getting thicker, and the aspect ratio is larger, which makes laser drilling more difficult. [0003] At present, for Skip Via holes (through-layer holes) in the industry, masks of equal size are used for direct processing, but due to the special design of large and deep holes, there is residual glue at the bottom of blind holes and it is difficult to clean, which seriously affects Reliability of blind vias af...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/02H05K3/42
Inventor 张军杰张峰黄银燕吴华军
Owner 江西志浩电子科技有限公司
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