Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Dual-channel cooling device for semiconductor laser

A cooling device and laser technology, applied in semiconductor lasers, lasers, laser parts and other directions, can solve the problems of overheating damage of semiconductor lasers, insufficient heat dissipation efficiency of heat sinks, poor stability and adaptability, etc., to improve heat dissipation and cooling efficiency, accelerate Heat dissipation and cooling efficiency, stable heat dissipation and cooling effect

Pending Publication Date: 2022-03-22
山东宝鑫达电子科技有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, as far as the current cooling devices of semiconductor lasers are concerned, most of them are heat sink structures, which guide the heat emitted by the semiconductor laser into the interior of the heat sink for natural cooling, and the cooling efficiency is slow and incomplete. Insufficient heat dissipation efficiency can easily lead to overheating and damage to the semiconductor laser, poor stability and adaptability, and low practicability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dual-channel cooling device for semiconductor laser
  • Dual-channel cooling device for semiconductor laser
  • Dual-channel cooling device for semiconductor laser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0036] Example: Please refer to Figure 1 to Figure 8 :

[0037] The present invention proposes a dual-channel cooling device for semiconductor lasers, comprising: a frame assembly 1; the frame assembly 1 includes a mounting frame 101 and a heat sink 102, and the heat sink 102 is fixedly installed on the top of the mounting frame 101; the semiconductor laser 2 , the semiconductor laser 2 is fixedly mounted on the top of the heat sink 102; the heat dissipation cooling assembly, the heat dissipation cooling assembly includes a cooling mechanism 3 and a circulation mechanism 4, the cooling mechanism 3 includes a heat dissipation fan 301 and a deflector 302, and the heat dissipation fan 301 is fixedly installed on The inside of the installation frame 101, and the deflector 302 is fixedly installed inside the installation frame 101; the circulation mechanism 4 includes a circulation cooling box 401, and the circulation cooling box 401 is fixedly installed on the side of the install...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a dual-channel cooling device for a semiconductor laser, and relates to the technical field of cooling devices. The heat dissipation base is fixedly installed at the top of the installation frame, the heat dissipation cooling assembly can greatly improve the heat dissipation cooling efficiency of the semiconductor laser, and the circulation mechanism can greatly reduce the temperature of airflow blown out by the top heat dissipation fan through cooling liquid, so that the heat dissipation efficiency of the heat dissipation base is improved through low-temperature airflow, and the heat dissipation efficiency of the semiconductor laser is improved. And the bottom heat dissipation fan can dissipate heat of the cooling liquid through the cooling channel, so that the temperature rise amplitude of the cooling liquid is reduced, the cooling liquid can be kept within a certain temperature range, and the semiconductor laser can be used for a long time. According to the invention, the problems of low cooling efficiency and overheat damage of the semiconductor laser easily caused by insufficient heat dissipation efficiency due to the fact that heat dissipated by the semiconductor laser is guided into the heat dissipation seat for natural cooling by the heat dissipation device are solved.

Description

technical field [0001] The invention relates to the technical field of cooling devices, in particular to a dual-channel cooling device for semiconductor lasers. Background technique [0002] Semiconductor lasers are lasers that use semiconductor materials as working substances. They are widely used in laser processing, laser medical treatment, laser display and scientific research. Semiconductor lasers are generally used in conjunction with heat sinks to realize the cooling function of semiconductor lasers. [0003] However, as far as the current cooling devices of semiconductor lasers are concerned, most of them are heat sink structures, which guide the heat emitted by the semiconductor laser into the interior of the heat sink for natural cooling, and the cooling efficiency is slow and incomplete. Insufficient heat dissipation efficiency can easily lead to overheating and damage to the semiconductor laser, poor stability and adaptability, and low practicability. Contents ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01S5/024
CPCH01S5/02407H01S5/02423H01S5/02476
Inventor 宗传坤
Owner 山东宝鑫达电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com