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Electrolytic stripping solution composition of copper-plated hanger and stripping solution cyclic regeneration method

A stripping solution and composition technology, which is applied in the field of electrolytic stripping solution composition and stripping solution cycle regeneration, can solve the problems of complex composition, high content of copper and nickel ions, high acidity, etc., and achieve the effect of overcoming difficult treatment

Pending Publication Date: 2022-03-22
HUIZHOU ZHENDING ENVIRONMENTAL PROTECTION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the main problems faced by the recovery of copper stripping solution are: high acidity, high content of copper and nickel ions, complex components, difficult to handle, and high recovery cost

Method used

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  • Electrolytic stripping solution composition of copper-plated hanger and stripping solution cyclic regeneration method
  • Electrolytic stripping solution composition of copper-plated hanger and stripping solution cyclic regeneration method
  • Electrolytic stripping solution composition of copper-plated hanger and stripping solution cyclic regeneration method

Examples

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Effect test

Embodiment 1

[0032] The electrolytic deplating solution composition of copper-plated hanger comprises the nitrate of 140g / L, the complexing agent of 90g / L, the accelerator of 5g / L, the solid corrosion inhibitor of 2.5g / L and the organic Corrosion inhibitor, the solid corrosion inhibitor is a mixture of thiourea and hexamethylenetetramine, the weight ratio of thiourea and hexamethylenetetramine is 1:0.2, and the electrolytic annealing of the copper-plated rack The plating solution composition is adjusted to a pH of 6.5-7.5 with a pH regulator.

[0033] In some embodiments of the present invention, the nitrate in the formulation system of the electrolytic deplating solution composition of the above-mentioned copper plating rack is sodium nitrate.

[0034] In some embodiments of the present invention, the complexing agent in the formulation system of the electrolytic deplating solution composition of the above-mentioned copper plating rack is EDTA.

[0035] In some embodiments of the present...

Embodiment 2

[0041] The composition of the electrolytic deplating solution for copper-plated racks includes 120g / L of nitrate, 60g / L of complexing agent, 0.5g / L of accelerator, 7g / L of solid corrosion inhibitor and 0.5-3g / L of Organic corrosion inhibitor, the solid corrosion inhibitor is a mixture of thiourea and hexamethylenetetramine, the weight ratio of thiourea and hexamethylenetetramine is 1:2.1, the electrolysis of the copper-plated rack The stripping solution composition is adjusted to pH 6.5-7.5 with a pH regulator.

[0042] In some embodiments of the present invention, the nitrate in the formulation system of the electrolytic deplating solution composition of the above-mentioned copper plating rack is sodium nitrate.

[0043] In some embodiments of the present invention, the complexing agent in the formula system of the electrolytic deplating solution composition for the above-mentioned copper plating rack is ethanolamine.

[0044] In some embodiments of the present invention, th...

Embodiment 3

[0050] The composition of the electrolytic deplating solution for copper-plated racks includes 180g / L of nitrate, 120g / L of complexing agent, 10g / L of accelerator, 12g / L of solid corrosion inhibitor and 3g / L of organic corrosion inhibitor agent, the solid corrosion inhibitor is a mixture of thiourea and hexamethylenetetramine, the weight ratio of thiourea and hexamethylenetetramine is 1:4, and the electrolytic deplating solution of the copper plating rack The composition is adjusted to pH 6.5-7.5 with a pH regulator.

[0051] In some embodiments of the present invention, the nitrate in the formulation system of the electrolytic deplating solution composition of the above-mentioned copper plating rack is sodium nitrate.

[0052] In some embodiments of the present invention, the complexing agent in the formula system of the electrolytic stripping solution composition of the above-mentioned copper plating rack is oleic acid.

[0053] In some embodiments of the present invention,...

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Abstract

The invention belongs to the technical field of plating layer deplating methods, and particularly relates to an electrolytic deplating solution composition of a copper plating hanger and a deplating solution cyclic regeneration method, the electrolytic deplating solution composition of the copper plating hanger comprises nitrate, a coordination agent, an accelerator, a solid corrosion inhibitor and an organic corrosion inhibitor, the solid corrosion inhibitor is a mixture of thiourea and hexamethylenetetramine, the weight ratio of thiourea to hexamethylenetetramine is 1: (0.2-4), the pH of the electrolytic stripping solution composition of the copper plating hanger is adjusted to 6.5-7.5 through the pH regulator, the electrolytic stripping solution composition can rapidly remove a copper plating layer, and after the stripping solution loses efficacy due to increase of the copper content, the copper plating layer can be rapidly removed. The precipitant is added to remove copper ions in the deplating solution, so that the deplating solution is regenerated, and the problem that the deplating solution is difficult to recover is effectively solved. According to the method for recycling the electrolytic stripping solution of the copper plating hanger, the problem that the stripping solution is difficult to treat and recycle after losing efficacy is solved.

Description

technical field [0001] The invention belongs to the technical field of plating deplating methods, and in particular relates to an electrolytic deplating solution composition for a copper plating rack and a method for recycling and regenerating the deplating solution. Background technique [0002] In the electroplating process, along with the electroplating (electroless plating) process, the hanger as the support of the plated part is also plated with various metal coatings. Because the hanger will be used repeatedly, it is necessary to completely remove the coating on the hanger before continuing to use it when plating a batch of plated parts and carrying out the electroplating of the next batch of plated parts. The rack generally adopts stainless steel base material, and the deplating process of the rack coating must meet the following requirements: first, the coating is removed quickly and completely, and second, the rack itself is not corroded. [0003] After the deplati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25F5/00
CPCC25F5/00
Inventor 王标罗国华梁汝华刘碧华
Owner HUIZHOU ZHENDING ENVIRONMENTAL PROTECTION TECH CO LTD
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