Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Integrated circuit chip with self-protection structure

An integrated circuit and protection structure technology, applied in the direction of supporting structure installation, providing connectors, printed circuit boards, electrical components, etc., can solve the problems of integrated circuit chip heat failure, integrated circuit chip damage, integrated circuit chip burning, etc. To achieve better heat exchange effect, prevent damage, and avoid unsatisfactory heat exchange effect

Pending Publication Date: 2022-03-15
深圳市中芯微实业有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For example, when the existing integrated circuit chip is used, it will generate a lot of heat, especially after a long time of use, and the existing integrated circuit chip is directly installed without protection function, which will cause the integrated circuit chip to be used for a long time. After time is used, the heat cannot be discharged, and the integrated circuit chip cannot be effectively exchanged for heat, which eventually leads to damage to the integrated circuit chip. Moreover, after the existing integrated circuit chip is connected to the circuit board, if a short circuit occurs, it will cause The integrated circuit chip is completely burned, causing losses

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integrated circuit chip with self-protection structure
  • Integrated circuit chip with self-protection structure
  • Integrated circuit chip with self-protection structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0032] The following is attached Figure 1-5 The present invention is described in further detail.

[0033] see Figure 1-5 , the present invention provides a technical solution: an integrated circuit chip with a self-protection structure, such as Figure 1-5 As shown, it includes a circuit board 1, a protective case 2 is provided in the middle of the top surface of the circuit board 1, an integrated circuit board chip 6 is provided inside the protective case 2, and a heat exchange assembly is provided above the protective case 2 3. An exhaust assembly 4 is arranged above the heat exchange assembly 3, and the protective shell 2 is fixedly clamped on the top surface of the circuit board 1 by clamping the installation assembly 5; the heat exchange assembly 3 includes a heat exchange plate 301 , the upper and lower surfaces of the heat exchange plate 301 are provided with a plurality of heat exhaust grooves 302, and the plurality of heat exhaust grooves 302 are equidistantly op...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an integrated circuit chip with a self-protection structure, and belongs to the technical field of integrated circuit chips, the integrated circuit chip comprises a circuit board, a protection shell is arranged in the middle of the top surface of the circuit board, an integrated circuit board chip is arranged in the protection shell, a heat exchange assembly is arranged above the protection shell, and the heat exchange assembly is connected with the integrated circuit board chip. An exhaust assembly is arranged above the heat exchange assembly, and the protective shell is fixedly clamped to the top surface of the circuit board through a clamping mounting assembly; by arranging the heat exchange assembly, when the integrated circuit board chip in the protective shell is used for a long time, heat is transmitted to the outer surface of the protective shell, and the bottom surface of a heat exchange plate is attached to the top surface of the protective shell, so that the heat is poured onto the heat exchange plate, and the heat exchange of the integrated circuit board chip in the protective shell is realized; and the integrated circuit board chip in the protective shell is subjected to heat exchange and cooling, so that the purpose of effectively cooling the integrated circuit board chip which is used for a long time in the protective shell is achieved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit chips, more specifically, it relates to an integrated circuit chip with a self-protection structure. Background technique [0002] With the rapid development of science and technology and the increasing application requirements for digital circuits, integrated circuit manufacturers actively adopt new technologies, improve design schemes and production processes, and make unremitting efforts in the direction of increasing speed, reducing power consumption, and reducing volume. New products of various models are continuously released, but there are still some problems in the use of existing integrated circuit chips. [0003] For example, when the existing integrated circuit chip is used, it will generate a lot of heat, especially after a long time of use, and the existing integrated circuit chip is directly installed without protection function, which will cause the integrated circuit chi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H05K7/20H05K7/14
CPCH05K5/0026H05K7/20145H05K7/20154H05K7/1417H05K7/20172H05K7/1452
Inventor 魏爱玲兴卫振刘滔
Owner 深圳市中芯微实业有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products