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Loudspeaker module

A speaker mold and module technology, applied in the electronic field, can solve problems such as product quality impact, glue overflow, air leakage, etc., and achieve the effects of improving product yield and processing efficiency, reducing production costs, and simplifying cumbersome processes

Pending Publication Date: 2022-03-01
LUXSHARE ELECTRONICS TECH (KUNSHAN) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the sounding unit in electronic equipment is assembled from multiple speakers with different audio frequencies and multiple parts, so it needs to be assembled and fixed through multiple processes. The quality is affected, such as uneven glue coating will cause air leakage, glue overflow and other problems
At the same time, the existing electronic equipment will inevitably be subjected to external impact during use, which will affect the function of the speaker and cause sound distortion

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] see Figure 1 to Figure 3 , this embodiment provides a speaker module, including a module case 1, a first shock absorber 2, a first speaker 3 and a first sound outlet pipe 5, and a front cavity 11 is opened on the surface of the module case 1; The first shock absorber 2 is arranged on the end face of the module housing 1 facing the front cavity 11; the first horn 3 is arranged on the first shock absorber 2, and the first horn 3 corresponds to the front cavity 11; the second The horn 4 is arranged on the module housing 1, and the sound outlet 41 of the second horn 4 is connected to the outer surface of the module housing 1 and communicates with the second sound outlet duct 121 of the module housing 1; the first sound outlet duct 5 Set in the module housing 1, one end communicates with the front cavity 11, and the other end communicates with the surface of the module housing 1 away from the front cavity 11, such as the side of the module housing 1 or the side facing away ...

Embodiment 2

[0064] This embodiment provides a speaker module, which includes a module housing 1 , a first shock absorber 2 , a first speaker 3 , a second speaker 4 , a first sound outlet pipe 5 and a rear cover 6 . The difference between this embodiment and the first embodiment is: see Figure 6 and Figure 7 , the first horn 3, the first shock absorber 2 and the rear cover 6 in this embodiment jointly define the rear cavity 61, and the first horn 3, the first shock absorber 2 and the module housing 1 jointly define the front cavity 11. The first shock absorber 2 is provided with a through hole 21, and the through hole 21 communicates with the rear cavity 61 and the front cavity 11 respectively. At this time, the rear cavity 61 can communicate with the front cavity 11, which can reduce the risk of getting close to the through hole. The binding force received by the first shock absorber 2 in part 21 improves the shock absorption effect.

[0065] see Figure 6 and Figure 7 , the first...

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Abstract

The invention relates to the technical field of electronics, in particular to a loudspeaker module which comprises a module shell, a first damping part, a first loudspeaker, a second loudspeaker and a first sound outlet pipeline, and a front cavity is formed in the surface of the module shell; the first damping piece is arranged on the end face, facing the front cavity, of the module shell. The first loudspeaker is arranged on the first damping piece, and the first loudspeaker corresponds to the interior of the front cavity; the second loudspeaker is arranged on the module shell, and a sound outlet of the second loudspeaker is communicated with the outer surface of the module shell; the first sound outlet pipeline is arranged in the module shell, one end of the first sound outlet pipeline communicates with the front cavity, and the other end of the first sound outlet pipeline communicates with the surface, away from the front cavity, of the module shell. According to the loudspeaker module, the front cavity, the first loudspeaker, the second loudspeaker, the first damping part and the first sound outlet pipeline are integrated on the module shell, the damping effect is achieved, the process of assembling loudspeaker parts in electronic equipment is simplified, the product yield and the machining efficiency are improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a speaker module. Background technique [0002] At present, the sounding unit in electronic equipment is assembled from multiple speakers with different audio frequencies and multiple parts, so it needs to be assembled and fixed through multiple processes. The quality is affected, such as uneven glue coating will cause air leakage, glue overflow and other problems. At the same time, the existing electronic equipment will inevitably be subjected to external impact during use, thereby affecting the function of the speaker and causing sound distortion. Contents of the invention [0003] The purpose of the present invention is to provide a speaker module, which simplifies the cumbersome process of assembling the speaker module into electronic equipment in the later stage, and can effectively absorb vibrations to ensure the sound quality of the speaker module. [0004] In orde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/28H04R1/02
CPCH04R1/28H04R1/02
Inventor 周枫马红梅张志强
Owner LUXSHARE ELECTRONICS TECH (KUNSHAN) LTD
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