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ESD device with fuse function

A technology of ESD devices and fuses, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of weakened performance of electronic components, product repair warranty costs, damaged devices, etc., to avoid repair and Quality assurance issues, powerful circuit protection functions, and the effect of mitigating fault intrusion

Inactive Publication Date: 2022-03-01
SHENZHEN SIPTORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of damage can sometimes directly damage the device and cause failure, and sometimes the failure may occur after a period of time after EOS
The performance of electronic components caused by EOS failure is weakened or even damaged, which leads to the problem of product repair or high warranty cost

Method used

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  • ESD device with fuse function
  • ESD device with fuse function
  • ESD device with fuse function

Examples

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Embodiment Construction

[0029] The technical solutions in the present application embodiment will be described in conjunction with the drawings in the present application embodiment. Obviously, the described embodiments are merely the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present application, those skilled in the art will belong to the scope of this application without all other embodiments obtained without creative labor.

[0030] In the description of the present application, it is to be understood that the term "first", "second" is used only for the purpose of describing purposes, and cannot be understood as an indication or implies a relative importance or implicitting the number of techniques indicated. Thus, features of "first", "second" may be indicated or implicitly including one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically defined.

[0031...

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PUM

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Abstract

The invention discloses an ESD device with a fuse function, the ESD device comprises a frame, a plurality of bonding pads arranged in the frame and a molding compound filling body filled in the frame, the plurality of bonding pads comprise a grounding bonding pad, a voltage output electric connection bonding pad and a voltage input electric connection bonding pad, a fuse is connected between the voltage output electric connection bonding pad and the voltage input electric connection bonding pad, an anti-static chip is mounted on the grounding bonding pad, and the anti-static chip is electrically connected with the voltage output electric connection bonding pad through a connecting wire. According to the ESD device with the fuse function, the anti-static chip and the fuse are arranged in the ESD device, overvoltage and overcurrent protection functions are provided for the ESD device, the ESD device has a powerful circuit protection function, sensitive electronic products are effectively protected, and the problems of expensive product repair and quality assurance caused by overvoltage or overcurrent failure are solved; the probability that electronic components suffer from EOS fault invasion is effectively reduced, and the reliability of products is improved.

Description

Technical field [0001] The present application relates to the field of electronic components circuit protection, in particular, to an ESD device having a fuse function. Background technique [0002] During practical applications, semiconductor electronic components often suffer from various EOS (Electrical Overstress excessive electrical stress) failure of its failure in practical applications. [0003] The instability of the power output quality, the noise of various overvoltage overcurrents, and the insertion current in the use of thermally inserts are all many factors that can generate EOS failure. This EOS is a short time overload, in In a short time, the electronic component is subject to the impact of spikes, the voltage, or the energy of the spike current exceeds the design rated value of the device, thereby damaging the device. [0004] When the current or voltage applied by the electronic component exceeds the maximum design specification required for the component, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/62H01L23/60
CPCH01L23/62H01L23/60
Inventor 邵冬冬
Owner SHENZHEN SIPTORY TECH CO LTD
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