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Magnetron sputtering forming device for mechanical performance testing of mesoscale bending specimens

A magnetron sputtering and bending technology, which is used in the application of stable bending force to test the strength of materials, measuring devices, and preparation of samples for testing, which can solve the problem that the magnetron sputtering forming device has not been disclosed, and achieve a clear outline. , good deformation consistency

Active Publication Date: 2022-06-24
HARBIN INST OF TECH AT WEIHAI
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  • Abstract
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  • Application Information

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Problems solved by technology

At present, the magnetron sputtering forming device for testing the mechanical properties of mesoscale bending specimens has not been disclosed

Method used

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  • Magnetron sputtering forming device for mechanical performance testing of mesoscale bending specimens
  • Magnetron sputtering forming device for mechanical performance testing of mesoscale bending specimens
  • Magnetron sputtering forming device for mechanical performance testing of mesoscale bending specimens

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Embodiment Construction

[0031]In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. The methods used in the present invention are conventional methods unless otherwise specified; the raw materials and devices used are conventional commercial products unless otherwise specified.

[0032] Depend on figure 2 , image 3 As shown, the mesoscopic scale bending sample 4 has an integrated structure, which is provided with a wide part clamping part 42 and a narrow and long test part 41, and the wide part clamping part 42 is connected to one end of the narrow and long test part 41. The upper and lower surfaces of the long and narrow test portion...

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Abstract

The invention provides a magnetron sputtering forming device for testing the mechanical properties of mesoscale bending samples, which solves the undisclosed problems of existing magnetron sputtering forming devices for testing the mechanical properties of mesoscopic bending samples Technical problem, the sample positioning frame is provided with a placement through hole for placing the bending sample, and the placement through hole matches the bending sample; the sample positioning frame is accommodated in the hollow frame, and the sample positioning frame is set on a pair of metal Between the coating forming plates, the metal coating forming plates are provided with first through holes distributed in an array, the first through holes are circular holes, and the diameter of the first through holes is micron order; a pair of metal coating forming plates are arranged on a pair of pressing plates Between them, a pair of pressure plates are detachably installed on the upper and lower sides of the hollow frame; the pressure plates on the upper and lower sides are respectively pressed on the adjacent metal-coated forming plates, so that a pair of metal-coated forming plates are respectively tightly pressed on the bending sample. The upper and lower surfaces of the long and narrow test part can be widely used in the technical field of material mechanical property measurement.

Description

technical field [0001] The present application relates to the technical field of material mechanical property measurement, in particular to a magnetron sputtering forming device used for testing the mechanical properties of mesoscopic-scale bending samples. Background technique [0002] With the development of the microelectronics and micromechanics industries, the demand for thin-plate micro-components is increasing. However, due to the existence of the scale effect of plastic deformation at the mesoscopic scale, the plastic deformation ability of the metal sheet is different from the macroscopic conditions. The plastic microforming process requires a systematic study of the plastic deformation behavior of metal sheets at the mesoscopic scale. [0003] Among them, since the bending process occupies a large proportion in the plastic micro-forming process of the thin plate, especially in the forming process of the micro lead frame, the micro-bending process plays an important...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N1/28G01N3/20C23C14/35C23C14/04C23C14/50C23C14/16
CPCG01N1/28G01N3/20C23C14/35C23C14/042C23C14/50C23C14/165G01N2203/0298G01N2203/0023
Inventor 张鹏王瀚朱强陈刚王传杰
Owner HARBIN INST OF TECH AT WEIHAI
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