Silicon wafer separating device

Abstract

The invention discloses a silicon wafer separating device. The device comprises a rack, a first conveying device and a second conveying device are arranged on the rack, the first conveying device comprises a pair of conveying belts, a first suction cup device and a second suction cup device are arranged above and below the first conveying device respectively, the first suction cup device comprises a lifting air cylinder and a suction cup, an image sensor and a thickness sensor are arranged above the first conveying device, and a translation air cylinder for driving the lifting air cylinder to move back and forth between the first conveying device and the second conveying device is arranged above the first conveying device. According to the silicon wafer separating device, an n surface and a p surface are distinguished through the image sensor, whether wafers are adhered or not is detected through the thickness sensor, the adhered wafers are separated through the suction cup devices arranged along a vertical direction, so that the silicon wafers with the p surface facing upwards and the silicon wafers with the n surface facing upwards are conveyed along the two conveying devices, wafer separation is fast, the automation level is high, wafer separation efficiency is improved, labor is saved, and the wafer rejection rate is reduced.

Description

technical field [0001] The present application relates to the field of silicon wafer slicing, in particular to a silicon wafer slicing device. Background technique [0002] In the semiconductor production process, the semiconductor silicon wafer is divided into n-side and p-side after sintering, and the n-side of adjacent silicon wafers will be bonded together. At present, manual segmentation is used. Due to the high bonding force of sintering, it is difficult to bond the n-side Separated, so it must be soaked in acid for a long time, and then manually sliced, even so, it is relatively easy to damage the silicon wafer, and the slice efficiency is low. Contents of the invention [0003] The object of the present invention is to provide a silicon chip slicing device to overcome the deficiencies in the prior art. [0004] To achieve the above object, the present invention provides the following technical solutions: [0005] The embodiment of the present application disclose...

AI Technical Summary

Problems solved by technology

[0002] In the semiconductor production process, the semiconductor silicon wafer is divided into n-side and p-side after sintering, and the n-side of adjacent silicon wafers will be bonded together. At present, manual segmentation is used. Due to the high bonding force of sintering, it is difficult to bond the n-side Separated, so it must be soaked in acid for a long time, and then manually divided into slices, even so, it is relatively easy to damage the silicon wafer, and the slice efficiency is low

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