Chip suction method and double-suction-head chip suction device

A suction device and chip technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of large space volume, complex structure, low integration level, etc., and achieve high integration level, volume saving, and high action accuracy Effect

Pending Publication Date: 2022-01-11
SHENZHEN HADESHENG PRECISION TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the deficiencies of the prior art, the present invention provides a chip pickup method and a double-sucker chip pickup device, which solve the technical defects of the prior art such as slow speed, poor precision, complex structure, large space volume, and low integration

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  • Chip suction method and double-suction-head chip suction device
  • Chip suction method and double-suction-head chip suction device
  • Chip suction method and double-suction-head chip suction device

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Embodiment Construction

[0026] The concept, specific structure and technical effects of the present invention will be clearly and completely described below with reference to the embodiments and accompanying drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts are all within the scope of The scope of protection of the present invention. In addition, all the coupling / connection relationships involved in the patent do not mean that the components are directly connected, but refer to a better coupling structure by adding or reducing coupling accessories according to the specific implementation. Various technical features in the present invention can be combined interactively on the premise of not ...

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Abstract

The invention discloses a chip suction method and a double-suction-head chip suction device. The chip suction method comprises the steps that a double-suction-head device is adopted to suck a chip, a CCD module is arranged in the double-suction-head device, an optical prism channel is arranged in a rotating shaft of the double-suction-head device, and the outer end of the optical prism channel adopts an optical prism to transmit the position of an external chip to the CCD module; a double-suction-head chip suction device comprises a shell, a mounting base, a rotary driving motor and a CCD module, a hollow rotating shaft is arranged on the mounting base, a suction head mounting plate is mounted at the outer end of the hollow rotating shaft, floating suction heads are arranged at the two ends of the suction head mounting plate, and an optical prism tube is further arranged in the shell. An optical prism channel, an optical opening and a reflecting prism are arranged in the optical prism tube. The chip suction method and the double-suction-head chip suction device have the advantages of being compact in structure and high in integration level, can improve the machining precision in practical application, are higher in action speed, and are beneficial to improving the production efficiency and the production quality.

Description

technical field [0001] The invention relates to the field of chip processing equipment, in particular to a chip suction method and a double suction head chip suction device. Background technique [0002] In the field of chip mounting, it is necessary to use a chip pick-up device for mounting work. [0003] Due to the limitation of structure or design of the existing chip mounting mechanism, the vision system needs to be installed outside, and the pipeline of the suction nozzle is directly connected to the outside and the outside, which leads to the complex structure of the entire mechanism, the large occupied space and volume, the difficulty of debugging, and the integration of The degree is not high. In addition, the action speed of the existing device is slow and the precision is poor, which affects the production efficiency and processing quality. [0004] In view of this, the purpose of the present invention is to provide a new technical solution to solve the existing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/68
CPCH01L21/6838H01L21/68
Inventor 王毅文莲张占平
Owner SHENZHEN HADESHENG PRECISION TECH
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