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Electronic product aging automatic test platform and test method thereof

A technology for automatic testing and electronic products, applied in electronic circuit testing, components of electrical measuring instruments, measuring electricity, etc., it can solve the problems of low degree of automation, low efficiency, inability to realize mechanized testing of semiconductor chips, etc., to achieve more flexible use. Change and improve the effect of test efficiency

Active Publication Date: 2021-12-10
山东博蓝建筑工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Relying on manual opening and closing of the aging test is low in automation, labor-intensive, and inefficient, and cannot realize mechanized testing of semiconductor chips

Method used

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  • Electronic product aging automatic test platform and test method thereof
  • Electronic product aging automatic test platform and test method thereof
  • Electronic product aging automatic test platform and test method thereof

Examples

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0022] In describing the embodiments o...

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Abstract

The invention discloses an electronic product aging automatic test platform and method, and the test platform comprises a test box body, the interior of the test box body is provided with at least two test cavities, each test cavity is internally provided with a test plate, the top of each test cavity is provided with a box door, and the top of the test box body is provided with grooves at the two sides of the box door. Mother plates are slidably installed in the grooves, sliding seats are fixedly connected to the tops of the mother plates, shaft rods fixedly connected to the two sides of the box door are embedded into the sliding seat and are in limiting movable fit connection with the sliding seats, two fixing plates are fixedly connected to the inner wall of each testing cavity, and a second air cylinder is fixedly connected to the top end of each fixing plate in the vertical direction; the top ends of the second cylinders are provided with magnetic rollers for supporting the box door, the top of the test box body is fixedly provided with a mounting seat between the two test cavities, and two ends of the mounting seat are rotatably provided with rollers in rolling connection with the lower end face of the box door. The electronic product aging automatic test platform can realize automatic opening and closing of the box door.

Description

technical field [0001] The invention belongs to the technical field of semiconductor testing equipment, and in particular relates to an electronic product aging automatic testing platform and a testing method thereof. Background technique [0002] Semiconductor chips must be subjected to burn-in tests before they leave the factory. Most of the burn-in test equipment in the prior art adopts a side-opening method. There are several layers of test boards in the burn-in test equipment, and several layers of test boards are arranged along the height direction of the burn-in test equipment. . Before the burn-in test, the door needs to be opened manually, and the semiconductor chips to be tested are installed on the test board. After the burn-in test is completed, the door needs to be closed manually, and the tested semiconductor chips are sorted to the set area. Relying on manual opening and closing of the door for burn-in testing is low in automation, labor-intensive, and ineffi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/02G01R1/04
CPCG01R31/2855G01R1/02G01R1/04
Inventor 孙伟王红
Owner 山东博蓝建筑工程有限公司
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